Fingerprint The fingerprint is based on mining the text of the scientific documents related to the associated persons. Based on that an index of weighted terms is created, which defines the key subjects of research unit

Software reliability Engineering & Materials Science
Decoding Engineering & Materials Science
Linear programming Engineering & Materials Science
Graph theory Engineering & Materials Science
Linear Codes Mathematics
Software engineering Engineering & Materials Science
Maximum likelihood Engineering & Materials Science
Binary Code Mathematics

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Profiles

No photo of Randy Fred Appel

Randy Fred Appel

Person: Academic

20142018
No photo of Naoki Endo

Naoki Endo

Person: Academic

20152019
No photo of Siyuan Fang

Siyuan Fang

Person: Academic

20162018

Research Output 2001 2019

Bayesian Independent Component Analysis under Hierarchical Model on Independent Components

Asaba, K., Saito, S., Horii, S. & Matsushima, T., 2019 Mar 4, 2018 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 959-962 4 p. 8659578. (2018 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2018 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Independent component analysis
Linear regression
Experiments

Introduction to university calculus for “Bunkei’’ students in waseda

Sobukawa, T., Takagi, S. & Uesu, H., 2019 Jan 1, In : Vysshee Obrazovanie v Rossii. 28, 2, p. 63-68 6 p.

Research output: Contribution to journalArticle

Open Access
Japan
mathematics
private university
hate
human sciences

Laying Groundwork for Writing and Developing Academic Papers from Presentation Slides

Nakamura, S., Morita, Y., Onuma, R., Nakayama, H., Kaminaga, H. & Miyadera, Y., 2019 Jan 31, 2018 IEEE Conference on e-Learning, e-Management and e-Services, IC3e 2018. Institute of Electrical and Electronics Engineers Inc., p. 79-84 6 p. 8632623. (2018 IEEE Conference on e-Learning, e-Management and e-Services, IC3e 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Organizing
Research activities