Research Organization for Nano & Life Innovation

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2020

A micromachined liquid chromatography chip with a pillar array mixer for post-column derivatization in the analysis of neurotransmitters

Isokawa, M., Nakanishi, K., Kanamori, T., Zhuang, H., Yamazaki, H., Sugaya, T., Yoon, D. H., Sekiguchi, T., Funatsu, T., Shoji, S. & Tsunoda, M., 2020, 21st International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2017. Chemical and Biological Microsystems Society, p. 1318-1319 2 p. (21st International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

RGB all Liquid-Based Microfluidic Quantum Dots Light-Emitting Diodes Using Deep-Blue Liquid Organic Semiconductor Backlight

Kawamura, M., Kuwae, H., Kamibayashi, T., Oshima, J., Kasahara, T., Shoji, S. & Mizuno, J., 2020 Jan, 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020. Institute of Electrical and Electronics Engineers Inc., p. 1238-1241 4 p. 9056181. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2020-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2019

Analysis of Longitudinal Leaky SAW on LiNbO3 Thin Plate/Amorphous Layer/Quartz Structure

Asakawa, S., Mizuno, J., Hayashi, J., Suzuki, M., Kakio, S., Tezuka, A., Kuwae, H., Yokota, H., Yonai, T. & Kishida, K., 2019 Oct, 2019 IEEE International Ultrasonics Symposium, IUS 2019. IEEE Computer Society, p. 675-678 4 p. 8925870. (IEEE International Ultrasonics Symposium, IUS; vol. 2019-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

Kuwae, H., Yamada, K., Momose, W., Shoji, S. & Mizuno, J., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

High-Color-Purity Microfluidic Quantum Dots Light-Emitting Diodes Using the Electroluminescence of the Liquid Organic Semiconductor Backlight

Kawamura, M., Kuwae, H., Kamibayashi, T., Oshima, J., Kasahara, T., Shoji, S. & Mizuno, J., 2019 Jun, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 724-727 4 p. 8808557. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

High-Efficiency Dibromination of Organic Compound in Microfluidic Channel of SI Pillar Array Directly Coated with Iron Catalys

Sugaya, T., Tanaka, D., Yoon, D. H., Nozaki, Y., Sekiguchi, T., Akitsu, T. & Shoji, S., 2019 Jun, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 2278-2281 4 p. 8808687. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO3/Quartz or LiNbO3/Quartz Bonding toward 5G Surface Acoustic Wave Devices

Tezuka, A., Kuwae, H., Yamada, K., Shoji, S., Kakio, S. & Mizuno, J., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 414-417 4 p. 8733501. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Study on role of inserted Pt intermediate layer deposited by atomic layer deposition for Cu-Cu quasi-direct bonding

Yamada, K., Kuwae, H., Kamibayashi, T., Shoji, S., Momose, W. & Mizuno, J., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735244. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Water-Electrokinetic Power Generation Device using Flexible Woody Carbon Film

Maeda, S., Kuwae, H., Sakamoto, K., Shoji, S. & Mizuno, J., 2019 Jan, 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019. Institute of Electrical and Electronics Engineers Inc., p. 233-236 4 p. 8870868. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2019-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2018

10μW/cm2-class high power density planar Si-nanowire thermoelectric energy harvester compatible with CMOS-VLSI technology

Tomita, M., Oba, S., Himeda, Y., Yamato, R., Shima, K., Kumada, T., Xu, M., Takezawa, H., Mesaki, K., Tsuda, K., Hashimoto, S., Zhan, T., Zhang, H., Kamakura, Y., Suzuki, Y., Inokawa, H., Ikeda, H., Matsukawa, T., Matsuki, T. & Watanabe, T., 2018 Oct 25, 2018 IEEE Symposium on VLSI Technology, VLSI Technology 2018. Institute of Electrical and Electronics Engineers Inc., Vol. 2018-June. p. 93-94 2 p. 8510659

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying

Saito, M., Mizuno, J., Koga, S. & Nishikawa, H., 2018 Nov 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546350

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Design Optimization and Fabrication of Simple Printable Piezoelectric Energy Harvest Device

Sasagawa, K., Yoon, D., Sekiguchi, T., Sasaki, T., Nakajima, T. & Shoji, S., 2018 Dec 3, NEMS 2018 - 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Institute of Electrical and Electronics Engineers Inc., p. 440-443 4 p. 8556859. (NEMS 2018 - 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrodeposition of Gold Electrode on Silicon Wafers for Submillimeter-wave Devices

Saito, M., Seto, H., Inoue, Y. & Hirokawa, J., 2018 Nov 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546341

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Evaluating the relationship between phonon and thermal properties of group IV alloys using molecular dynamics simulation

Tomita, M., Ogasawara, M., Terada, T. & Watanabe, T., 2018 Jan 1, ECS Transactions. Hartmann, J-M., Thean, A., Ogura, A., Gong, X., Harame, D., Caymax, M., Niu, G., Schulze, A., Liu, Q., Mashi, G., Miyazaki, S., Mai, A. & Osting, M. (eds.). 7 ed. Electrochemical Society Inc., Vol. 86. p. 337-345 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Evaluation of laterally graded silicon germanium wires for thermoelectric devices fabricated by rapid melting growth

Yokogawa, R., Hashimoto, S., Takahashi, K., Oba, S., Tomita, M., Kurosawa, M., Watanabe, T. & Ogura, A., 2018 Jan 1, ECS Transactions. Hartmann, J-M., Thean, A., Ogura, A., Gong, X., Harame, D., Caymax, M., Niu, G., Schulze, A., Liu, Q., Mashi, G., Miyazaki, S., Mai, A. & Osting, M. (eds.). 7 ed. Electrochemical Society Inc., Vol. 86. p. 87-93 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Fabrication of microchannel-TEM grid for in situ liquid observation of interfacial chemical reaction

Miwa, K., Kuwae, H., Sakamoto, K., Shoji, S. & Mizuno, J., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 284-287 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

HAMR emulation using plasmonic SERS sensor as near field transducer

Yanagisawa, M., Kunimoto, M., Saito, M. & Homma, T., 2018 Jan 1, ASME-JSME 2018 Joint International Conference on Information Storage and Processing Systems and Micromechatronics for Information and Precision Equipment, ISPS-MIPE 2018. American Society of Mechanical Engineers (ASME)

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Longitudinal Leaky Surface Acoustic Wave with Low Attenuation on LiTaO3 Thin Plate Bonded to Quartz Substrate

Hayashi, J., Suzuki, M., Yonai, T., Yamaya, K., Kakio, S., Kishida, K., Asakawa, S., Kuwae, H. & Mizuno, J., 2018 Dec 17, 2018 IEEE International Ultrasonics Symposium, IUS 2018. IEEE Computer Society, Vol. 2018-October. 8579715

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Measurement of the Cell Migration and Cytokine Secretion Activity with Real-Time Imaging System

Tanaka, Y., Suzuki, N., Moro, K., Mizuno, J., Shoji, S., Uemura, S. & Shirasaki, Y., 2018 Dec, MHS 2018 - 2018 29th International Symposium on Micro-NanoMechatronics and Human Science. Institute of Electrical and Electronics Engineers Inc., 8887045. (MHS 2018 - 2018 29th International Symposium on Micro-NanoMechatronics and Human Science).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Oil-in-water droplet formation in hydrophobic PDMS device using three-dimensional protruded taper channel

Tang, C., Yoon, D. H., Sekiguchi, T. & Shoji, S., 2018, 22nd International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2018. Chemical and Biological Microsystems Society, p. 395-397 3 p. (22nd International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2018; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermoelectric Characteristics of Rapid-Melting-Grown SiGe Wires Measured by Peltier Cooling Experiment

Hashimoto, S., Takahashi, K., Oba, S., Terada, T., Ogasawara, M., Tomita, M., Kurosawa, M. & Watanabe, T., 2018 Jul 26, 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 283-285 3 p. 8421517

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2017

A scalable Si-based micro thermoelectric generator

Watanabe, T., Asada, S., Xu, T., Hashimoto, S., Ohba, S., Himeda, Y., Yamato, R., Zhang, H., Tomita, M., Matsukawa, T., Kamakura, Y. & Ikeda, H., 2017 Jun 13, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 86-87 2 p. 7947519

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation

Fu, W., Ma, B., Kuwae, H., Shoji, S. & Mizuno, J., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 69 1 p. 7947465

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Cu-Cu direct bonding by introducing Au intermediate layer

Noma, H., Kamibayashi, T., Kuwae, H., Suzuki, N., Nonaka, T., Shoji, S. & Mizuno, J., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 70 1 p. 7947466

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Deep-blue light emission with a wide-bandgap naphthalene-derivative liquid organic semiconductor host

Kobayashi, N., Kuwae, H., Oshima, J., Ishimatsu, R., Tashiro, S., Imato, T., Adachi, C., Shoji, S. & Mizuno, J., 2017, Organic Photonic Materials and Devices XIX 2017. SPIE, Vol. 10101. 101011B

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fabrication of self-standing curved film with pillar arrays by large area spherical soft-UV imprint lithography

Kamibayashi, T., Kuwae, H., Nobori, A., Shoji, S. & Mizuno, J., 2017 Jun 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 148-151 4 p. 7939344

Research output: Chapter in Book/Report/Conference proceedingConference contribution

High-coupling leaky SAWs on LiTaO3 thin plate bonded to quartz substrate

Hayashi, J., Gomi, M., Suzuki, M., Kakio, S., Suzaki, H., Yonai, T., Kishida, K. & Mizuno, J., 2017 Oct 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091566

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

High-coupling leaky SAWs on LiTaO3 thin plate bonded to quartz substrate

Hayashi, J., Gomi, M., Suzuki, M., Kakio, S., Suzaki, H., Yonai, T., Kishida, K. & Mizuno, J., 2017 Oct 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091675

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Highly bendable transparent electrode using mesh patterned indium tin oxide for flexible electronic devices

Sakamoto, K., Kuwae, H., Kobayashi, N., Nobori, A., Shoji, S. & Mizuno, J., 2017 Aug 25, 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc., p. 323-326 4 p. 8017034

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Fu, W., Kuwae, H., Ma, B., Shoji, S. & Mizuno, J., 2017 Jun 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 167-170 4 p. 7939349

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plate-laminated corporate-feed slotted waveguide array antenna at 350-GHz band by silicon process

Tekkouk, K., Hirokawa, J., Oogimoto, K., Nagatsuma, T., Seto, H., Inoue, Y. & Saito, M., 2017 Jan 17, ISAP 2016 - International Symposium on Antennas and Propagation. Institute of Electrical and Electronics Engineers Inc., p. 538-539 2 p. 7821191

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Widefield real-time single-cell secretion imaging with optical waveguide technique

Tanaka, Y., Suzuki, N., Mora, K., Mizuno, J., Shoji, S., Uemura, S. & Shirasaki, Y., 2017 Jul 26, TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., p. 1580-1583 4 p. 7994363. (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2016

All-round micro sheath flow formation to realize complex cross sections by simply stacked PDMs structures

Yoon, D., Ariyoshi, L., Tanaka, D., Sekiguchi, T. & Shoji, S., 2016 Feb 26, MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-February. p. 141-144 4 p. 7421578

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Complex check-like cross-sectional flow formation for fiber-shaped materials

Kobayashi, K., Yoon, D., Sekiguchi, T. & Shoji, S., 2016, 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2016. Chemical and Biological Microsystems Society, p. 836-837 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Corporate-feed slotted wavguide array antenna at 350 GHz band by silicon process

Tekkouk, K., Hirokawa, J., Oogimoto, K., Nagatsuma, T., Seto, H., Inoue, Y. & Saito, M., 2016 Oct 25, 2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1197-1198 2 p. 7696306

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Development of a simple fabrication process for a printable piezoelectric energy harvest device

Kamata, Y., Yoon, D., Sasaki, T., Nozaki, Y., Yamaura, S., Sekiguchi, T., Nakajima, T. & Shoji, S., 2016 Nov 28, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc., p. 520-523 4 p. 7758304

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Development of interatomic potential of group IV alloy semiconductors for lattice dynamics simulation

Tomita, M., Ogura, A. & Watanabe, T., 2016 Jan 1, SiGe, Ge, and Related Materials: Materials, Processing, and Devices 7. 8 ed. Electrochemical Society Inc., Vol. 75. p. 785-794 10 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

Nishikawa, H., Matsunaga, K., Kim, M. S., Saito, M. & Mizuno, J., 2016, IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016. IMAPS-International Microelectronics and Packaging Society

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrodeposition of ZnO from acetate bath for thermoelectric devices

Matsuo, H., Yoshitoku, K., Furuyama, D., Saito, M. & Homma, T., 2016 Jan 1, General Student Poster Session. 52 ed. Electrochemical Society Inc., Vol. 75. p. 143-148 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Fabrication process of fluidic devices for producing fine droplets using a focused ion beam system

Nozaki, Y., Kanai, T., Matsuo, A., Tanaka, D., Yuito, I., Takeuchi, T., Sekiguchi, T. & Shoji, S., 2016 Nov 21, 16th International Conference on Nanotechnology - IEEE NANO 2016. Institute of Electrical and Electronics Engineers Inc., p. 795-798 4 p. 7751484

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fifty-second analysis of oxidative stress markers in human plasma using amide-modified liquid chromatography chip

Isokawa, M., Nakanishi, K., Yoon, D., Sekiguchi, T., Funatsu, T., Shoji, S. & Tsunoda, M., 2016, 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2016. Chemical and Biological Microsystems Society, p. 583-584 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Flexible organic light emitting diode ribbons using three liquid organic semiconductors

Nobori, A., Kobayashi, N., Kuwae, H., Kasahara, T., Oshima, J., Adachi, C., Shoji, S. & Mizuno, J., 2016 Nov 28, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc., p. 38-41 4 p. 7758195

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Industrialization trial of a biosensor technology

Ohashi, K. & Osaka, T., 2016 Jan 1, Contemporary Issues and Case Studies in Electrochemical Innovation 2. 39 ed. Electrochemical Society Inc., Vol. 75. p. 1-9 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

In vitro selection of novel peptide agonists for human somatostatin receptor subtype-2 using a water-in-oil microdroplet platform

Sakurai, T., Iizuka, R., Nakamura, Y., Ishii, J., Kondo, A., Iguchi, A., Yoon, D., Sekiguchi, T., Shoji, S. & Funatsu, T., 2016, 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2016. Chemical and Biological Microsystems Society, p. 593-594 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments

Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 302-305 4 p. 7486834

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Low temperature direct bonding of single crystal quartz substrates for high performance optical low pass filter using amorphous SiO2 intermediate layers

Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 Feb 26, MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-February. p. 25-28 4 p. 7421548

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Simultaneous fabrication of a through-glass interconnect via and bumps using dry filling process of submicron gold particles

Nomura, K., Okada, A., Shoji, S., Ogashiwa, T. & Mizuno, J., 2016 Dec 27, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, p. 270-272 3 p. 7799988

Research output: Chapter in Book/Report/Conference proceedingConference contribution

ST-quartz/LiTaO3 direct bonding using SiO2 amorphous layers with VUV/O3 pre-treatment for a novel 5G surface acoustic wave device

Suzaki, H., Kuwae, H., Okada, A., Ma, B., Shoji, S. & Mizuno, J., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 443-446 4 p. 7486865

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)