Fengwen Mu

次席研究員(研究院講師)

  • 145 Citations
  • 7 h-Index
20112019
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Fingerprint Dive into the research topics where Fengwen Mu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 21 Similar Profiles
Wafer bonding Engineering & Materials Science
Temperature Engineering & Materials Science
Sintering Engineering & Materials Science
Nanoparticles Engineering & Materials Science
Diamond Chemical Compounds
Electronics packaging Engineering & Materials Science
wafers Physics & Astronomy
Adhesive pastes Engineering & Materials Science

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Research Output 2011 2019

  • 145 Citations
  • 7 h-Index
  • 19 Conference contribution
  • 17 Article
  • 2 Review article

De-bondable SiC–SiC wafer bonding via an intermediate Ni nano-film

Mu, F., Uomoto, M., Shimatsu, T., Wang, Y., Iguchi, K., Nakazawa, H., Takahashi, Y., Higurashi, E. & Suga, T., 2019 Jan 28, In : Applied Surface Science. 465, p. 591-595 5 p.

Research output: Contribution to journalArticle

Wafer bonding
Nickel
nickel
wafers
Silicon carbide

Direct wafer bonding of Ga2O3–SiC at room temperature

Xu, Y., Mu, F., Wang, Y., Chen, D., Ou, X. & Suga, T., 2019 Apr 1, In : Ceramics International. 45, 5, p. 6552-6555 4 p.

Research output: Contribution to journalArticle

Wafer bonding
Annealing
Ion beams
Temperature
Thermal conductivity

GaN-SiC and GaN-diamond integration via room temperature bonding

Mu, F. & Suga, T., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735398. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Diamond
Diamonds
Temperature
Thermal conductivity
Substrates

Integration of GaN-SiC and GaN-diamond by surface activated bonding methods

Mu, F. & Suga, T., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 198-199 2 p. 8733419. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Diamond
Diamonds
Heat losses
Temperature

Low temperature Cu bonding with large tolerance of surface oxidation

Ren, H., Mu, F., Shin, S., Liu, L., Zou, G. & Suga, T., 2019 May 1, In : AIP Advances. 9, 5, 055127.

Research output: Contribution to journalArticle

Open Access
oxidation
formic acid
chips
vapors
nanoparticles