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Hiroyuki Kuwae

助教

  • 48 Citations
  • 4 h-Index
20142019
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  • 3 Similar Profiles
Organic light emitting diodes (OLED) Chemical Compounds
Quartz Chemical Compounds
Semiconducting organic compounds Chemical Compounds
Acoustic surface wave devices Engineering & Materials Science
Atomic layer deposition Engineering & Materials Science
Liquids Chemical Compounds
Microfluidics Engineering & Materials Science
Substrates Engineering & Materials Science

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Research Output 2014 2019

  • 48 Citations
  • 4 h-Index
  • 20 Conference contribution
  • 10 Article
  • 1 Review article

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

Kuwae, H., Yamada, K., Momose, W., Shoji, S. & Mizuno, J., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Atomic layer deposition
Metalloids
Beer
Metals
Temperature
1 Citation (Scopus)

High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Aspect ratio
Resins
Thermosets
Fillers
Silica
1 Citation (Scopus)

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Atomic layer deposition
Platinum
Copper
Temperature
Ultrathin films

New Era of Device Science

Kasahara, T., Kuwae, H. & Mizuno, J., 2019 Apr 22, 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019. Institute of Electrical and Electronics Engineers Inc., 8696587. (2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Organic light emitting diodes (OLED)
Nanotechnology
Semiconductor materials
NEMS
Luminescent devices

Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO3/Quartz or LiNbO3/Quartz Bonding toward 5G Surface Acoustic Wave Devices

Tezuka, A., Kuwae, H., Yamada, K., Shoji, S., Kakio, S. & Mizuno, J., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 414-417 4 p. 8733501. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Acoustic surface wave devices
Quartz
Amorphous films
Residual stresses
Substrates