• 58 Citations
  • 4 h-Index
20142019
If you made any changes in Pure these will be visible here soon.

Fingerprint Dive into the research topics where Hiroyuki Kuwae is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 3 Similar Profiles
Semiconducting organic compounds Chemical Compounds
Organic light emitting diodes (OLED) Chemical Compounds
Quartz Chemical Compounds
Acoustic surface wave devices Engineering & Materials Science
Microfluidics Engineering & Materials Science
Atomic layer deposition Engineering & Materials Science
Electroluminescence Chemical Compounds
Liquids Chemical Compounds

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output 2014 2019

  • 58 Citations
  • 4 h-Index
  • 21 Conference contribution
  • 10 Article
  • 1 Review article
1 Citation (Scopus)

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

Kuwae, H., Yamada, K., Momose, W., Shoji, S. & Mizuno, J., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Atomic layer deposition
Metalloids
Beer
Metals
Temperature
1 Citation (Scopus)

High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Aspect ratio
Resins
Thermosets
Fillers
Silica

High-Color-Purity Microfluidic Quantum Dots Light-Emitting Diodes Using the Electroluminescence of the Liquid Organic Semiconductor Backlight

Kawamura, M., Kuwae, H., Kamibayashi, T., Oshima, J., Kasahara, T., Shoji, S. & Mizuno, J., 2019 Jun 1, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 724-727 4 p. 8808557. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Organic Semiconductors
Electroluminescence
Semiconducting organic compounds
Microfluidics
organic semiconductors
1 Citation (Scopus)

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Atomic layer deposition
Platinum
Copper
Temperature
Ultrathin films

New Era of Device Science

Kasahara, T., Kuwae, H. & Mizuno, J., 2019 Apr 22, 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019. Institute of Electrical and Electronics Engineers Inc., 8696587. (2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Organic light emitting diodes (OLED)
Nanotechnology
Semiconductor materials
NEMS
Luminescent devices