Jun Mizuno

上級研究員(研究院教授)

  • 1486 Citations
  • 19 h-Index
19952019

Research output per year

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Research Output

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

Kuwae, H., Yamada, K., Momose, W., Shoji, S. & Mizuno, J., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)

    High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

    Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)

    High-Color-Purity Microfluidic Quantum Dots Light-Emitting Diodes Using the Electroluminescence of the Liquid Organic Semiconductor Backlight

    Kawamura, M., Kuwae, H., Kamibayashi, T., Oshima, J., Kasahara, T., Shoji, S. & Mizuno, J., 2019 Jun, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 724-727 4 p. 8808557. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)

    Longitudinal leaky surface acoustic wave with low attenuation on LiTaO3 or LiNbO3 thin plate bonded to quartz substrate

    Hayashi, J., Yamaya, K., Asakawa, S., Suzuki, M., Kakio, S., Tezuka, A., Kuwae, H., Yonai, T., Kishida, K. & Mizuno, J., 2019 Jan 1, In : Japanese journal of applied physics. 58, SG, SGGC12.

    Research output: Contribution to journalArticle

  • 6 Citations (Scopus)

    Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

    Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)