Jun Mizuno

上級研究員(研究院教授)

  • 1518 Citations
  • 19 h-Index
19952019

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2019

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

Kuwae, H., Yamada, K., Momose, W., Shoji, S. & Mizuno, J., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

High-Color-Purity Microfluidic Quantum Dots Light-Emitting Diodes Using the Electroluminescence of the Liquid Organic Semiconductor Backlight

Kawamura, M., Kuwae, H., Kamibayashi, T., Oshima, J., Kasahara, T., Shoji, S. & Mizuno, J., 2019 Jun, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 724-727 4 p. 8808557. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

New Era of Device Science

Kasahara, T., Kuwae, H. & Mizuno, J., 2019 Apr 22, 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019. Institute of Electrical and Electronics Engineers Inc., 8696587. (2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO3/Quartz or LiNbO3/Quartz Bonding toward 5G Surface Acoustic Wave Devices

Tezuka, A., Kuwae, H., Yamada, K., Shoji, S., Kakio, S. & Mizuno, J., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 414-417 4 p. 8733501. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Study on role of inserted Pt intermediate layer deposited by atomic layer deposition for Cu-Cu quasi-direct bonding

Yamada, K., Kuwae, H., Kamibayashi, T., Shoji, S., Momose, W. & Mizuno, J., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735244. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2018

Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying

Saito, M., Mizuno, J., Koga, S. & Nishikawa, H., 2018 Nov 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546350

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fabrication of microchannel-TEM grid for in situ liquid observation of interfacial chemical reaction

Miwa, K., Kuwae, H., Sakamoto, K., Shoji, S. & Mizuno, J., 2018 Jun 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 284-287 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Longitudinal Leaky Surface Acoustic Wave with Low Attenuation on LiTaO3 Thin Plate Bonded to Quartz Substrate

Hayashi, J., Suzuki, M., Yonai, T., Yamaya, K., Kakio, S., Kishida, K., Asakawa, S., Kuwae, H. & Mizuno, J., 2018 Dec 17, 2018 IEEE International Ultrasonics Symposium, IUS 2018. IEEE Computer Society, Vol. 2018-October. 8579715

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)
2017

A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation

Fu, W., Ma, B., Kuwae, H., Shoji, S. & Mizuno, J., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 69 1 p. 7947465

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Cu-Cu direct bonding by introducing Au intermediate layer

Noma, H., Kamibayashi, T., Kuwae, H., Suzuki, N., Nonaka, T., Shoji, S. & Mizuno, J., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 70 1 p. 7947466

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Deep-blue light emission with a wide-bandgap naphthalene-derivative liquid organic semiconductor host

Kobayashi, N., Kuwae, H., Oshima, J., Ishimatsu, R., Tashiro, S., Imato, T., Adachi, C., Shoji, S. & Mizuno, J., 2017, Organic Photonic Materials and Devices XIX 2017. SPIE, Vol. 10101. 101011B

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fabrication of self-standing curved film with pillar arrays by large area spherical soft-UV imprint lithography

Kamibayashi, T., Kuwae, H., Nobori, A., Shoji, S. & Mizuno, J., 2017 Jun 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 148-151 4 p. 7939344

Research output: Chapter in Book/Report/Conference proceedingConference contribution

High-coupling leaky SAWs on LiTaO3 thin plate bonded to quartz substrate

Hayashi, J., Gomi, M., Suzuki, M., Kakio, S., Suzaki, H., Yonai, T., Kishida, K. & Mizuno, J., 2017 Oct 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091675

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

High-coupling leaky SAWs on LiTaO3 thin plate bonded to quartz substrate

Hayashi, J., Gomi, M., Suzuki, M., Kakio, S., Suzaki, H., Yonai, T., Kishida, K. & Mizuno, J., 2017 Oct 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091566

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Highly bendable transparent electrode using mesh patterned indium tin oxide for flexible electronic devices

Sakamoto, K., Kuwae, H., Kobayashi, N., Nobori, A., Shoji, S. & Mizuno, J., 2017 Aug 25, 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc., p. 323-326 4 p. 8017034

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Fu, W., Kuwae, H., Ma, B., Shoji, S. & Mizuno, J., 2017 Jun 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 167-170 4 p. 7939349

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Widefield real-time single-cell secretion imaging with optical waveguide technique

Tanaka, Y., Suzuki, N., Mora, K., Mizuno, J., Shoji, S., Uemura, S. & Shirasaki, Y., 2017 Jul 26, TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., p. 1580-1583 4 p. 7994363. (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2016

Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

Nishikawa, H., Matsunaga, K., Kim, M. S., Saito, M. & Mizuno, J., 2016, IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016. IMAPS-International Microelectronics and Packaging Society

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Flexible organic light emitting diode ribbons using three liquid organic semiconductors

Nobori, A., Kobayashi, N., Kuwae, H., Kasahara, T., Oshima, J., Adachi, C., Shoji, S. & Mizuno, J., 2016 Nov 28, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc., p. 38-41 4 p. 7758195

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification

Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 Aug 16, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-August. p. 2541-2546 6 p. 7545784

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments

Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 302-305 4 p. 7486834

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Low temperature direct bonding of single crystal quartz substrates for high performance optical low pass filter using amorphous SiO2 intermediate layers

Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 Feb 26, MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-February. p. 25-28 4 p. 7421548

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Simultaneous fabrication of a through-glass interconnect via and bumps using dry filling process of submicron gold particles

Nomura, K., Okada, A., Shoji, S., Ogashiwa, T. & Mizuno, J., 2016 Dec 27, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, p. 270-272 3 p. 7799988

Research output: Chapter in Book/Report/Conference proceedingConference contribution

ST-quartz/LiTaO3 direct bonding using SiO2 amorphous layers with VUV/O3 pre-treatment for a novel 5G surface acoustic wave device

Suzaki, H., Kuwae, H., Okada, A., Ma, B., Shoji, S. & Mizuno, J., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 443-446 4 p. 7486865

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Study of LiTaO3/ST-quartz Bonding with Amorphous Interlayer Assisted by VUV/O3 Treatment for SAW Device

Suzaki, H., Kuwae, H., Okada, A., Shoji, S. & Mizuno, J., 2016 Dec 27, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, p. 239-242 4 p. 7799986

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

VUV/O3 assisted single crystal quartz bonding with amorphous SiO2 intermedicate layer for manufacturing optical low pass filter

Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 447-450 4 p. 7486866

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2015

A double-sided in-plane lateral comb-drive actuator fabricated by a plaster-based 3D-printer

Mizuno, J. & Takahashi, S., 2015 Jan 1, Recent Development in Machining, Materials and Mechanical Technologies. Chen, J-C., Hiroshi, U., Lee, S-W. & Fuh, Y-K. (eds.). Trans Tech Publications Ltd, p. 594-599 6 p. (Key Engineering Materials; vol. 656-657).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Effect of Au nanoporous structure on bonding strength

Matsunaga, K., Kim, M. S., Nishikawa, H., Saito, M. & Mizuno, J., 2015 May 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 830-833 4 p. 7111127

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles

Nomura, K., Okada, A., Shoji, S., Ogashiwa, T. & Mizuno, J., 2015 Dec 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 46-49 4 p. 7365176

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fabrication of a hermetic sealing device using low temperature intrinsic-silicon/glass bonding

Nomura, K., Mizuno, J., Okada, A., Shoji, S. & Ogashiwa, T., 2015 May 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 444-447 4 p. 7111054

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch

Ohyama, M., Nimura, M., Mizuno, J., Shoji, S., Tamura, M., Enomoto, T. & Shigetou, A., 2015 Jul 15, 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Institute of Electrical and Electronics Engineers Inc., p. 325-330 6 p. 7159612. (Proceedings - Electronic Components and Technology Conference; vol. 2015-July).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Improved low temperature gold-gold bonding using nanoporous powder bump using vacuum ultraviolet irradiation pre-treatment

Kaneda, T., Mizuno, J., Okada, A., Matsunaga, K., Shoji, S., Saito, M. & Nishikawa, H., 2015 May 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 473-477 5 p. 7111061

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Improvement of surface properties on microfluidic devices by Diamond-Like Carbon coatings

Murayama, Y., Shiba, K., Ohgoe, Y., Mizuno, J., Shoji, S., Ozeki, K., Sato, K., Alanazi, A. & Hirakuri, K., 2015 May 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 874-877 4 p. 7111138

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Light trapping of organic solar cells by nanotextured surfaces

Kubota, S., Kanomata, K., Ahmmad, B., Mizuno, J. & Hirose, F., 2015 May 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 428-431 4 p. 7111050

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Low temperature direct bonding of polyether ether ketone (PEEK) and Pt

Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2015 Dec 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 217-220 4 p. 7365179

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Microfluidic white organic light-emitting diode based on striped fine microchannels for greenish blue and yellow liquid emitters

Kobayashi, N., Kasahara, T., Edura, T., Oshima, J., Ishimatsu, R., Tsuwaki, M., Imato, T., Shoji, S. & Mizuno, J., 2015 Aug 5, 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. Institute of Electrical and Electronics Engineers Inc., p. 2049-2052 4 p. 7181359

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vacuum ultraviolet (VUV) and vapor-combined surface modification for hybrid bonding at low temperature and atmospheric pressure

Shigetou, A., Mizuno, J. & Shoji, S., 2015 May 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 239-242 4 p. 7111030

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vacuum ultraviolet (VUV) and vapor-combined surface modification for hybrid bonding of SiC, GaN, and Si substrates at low temperature and atmospheric pressure

Shigetou, A., Mizuno, J. & Shoji, S., 2015 Jul 15, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., Vol. 2015-July. p. 1498-1501 4 p. 7159796

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)
2014

Fast and simultaneous analysis of phenylalanine and tyrosine in plasma using pillar array columns with a gradient elution system

Isokawa, M., Song, Y., Takatsuki, K., Sekiguchi, T., Mizuno, J., Funatsu, T., Shoji, S. & Tsunoda, M., 2014, 18th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2014. Chemical and Biological Microsystems Society, p. 941-943 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fine-pitch hybrid bonding with Cu/Sn microbumps and adhesive for high density 3D integration

Ohyama, M., Mizuno, J., Shoji, S., Nimura, M., Nonaka, T., Shinba, Y. & Shigetou, A., 2014 Jan 1, 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, p. 604-607 4 p. 6826751. (2014 International Conference on Electronics Packaging, ICEP 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Fine-pitch interconnection by hybrid Cu/Sn-adhesive bonding for 3D integration

Ohyama, M., Mizuno, J., Shoji, S., Nimura, M., Nonaka, T., Shinba, Y. & Shigetou, A., 2014 Jan 1, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 1 p. 6886187. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Flexible and capacitive tactile sensor sheet

Mizushima, M., Takagi, S., Itano, H., Obata, T., Kasahara, T., Shoji, S. & Mizuno, J., 2014 Jan 1, 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, p. 756-759 4 p. 6826783. (2014 International Conference on Electronics Packaging, ICEP 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Hemocompatibility of DLC coating for blood analysis devices

Shiba, K., Ohgoe, Y., Hirakuri, K., Mizuno, J., Shoji, S., Ozeki, K., Sato, K., Fukata, N. & Alanazi, A., 2014 Jan 1, 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, p. 748-751 4 p. 6826781. (2014 International Conference on Electronics Packaging, ICEP 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Low temperature and low pressure bump bonding realized by single-micrometer Ag-nanoparticle bumps

Fu, W., Kasahara, T., Okada, A., Shoji, S., Shigetou, A. & Mizuno, J., 2014 Jan 1, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 1 p. 6886186. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

Mimatsu, H., Mizuno, J., Kasahara, T., Saito, M., Shoji, S. & Nishikawa, H., 2014 Jan 1, MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., p. 1131-1134 4 p. 6765845. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Microfluidic electrochemiluminescence (ECL) integrated flow cell for portable fluorescence detection

Tsuwaki, M., Mizuno, J., Kasahara, T., Edura, T., Kunisawa, E., Ishimatsu, R., Matsunami, S., Imato, T., Adachi, C. & Shoji, S., 2014 Jan 1, MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., p. 108-111 4 p. 6765585. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding

Saito, M., Matsunaga, K., Mizuno, J. & Nishikawa, H., 2014 Nov 18, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 6962819. (Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Nonlinear optical property of CNT embedded in Si slot waveguide

Fukuda, K., Yamada, S., Kuwae, H., Mizuno, J., Takashima, T., Matsushima, Y. & Utaka, K., 2014 Jan 1, 2014 OptoElectronics and Communication Conference, OECC 2014 and Australian Conference on Optical Fibre Technology, ACOFT 2014. IEEE Computer Society, p. 1041-1042 2 p. 6888365. (2014 OptoElectronics and Communication Conference, OECC 2014 and Australian Conference on Optical Fibre Technology, ACOFT 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution