• 1 Citations
  • 1 h-Index
20182019

Research output per year

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Fingerprint Dive into the research topics where Keiko Koshiba is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

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Research Output

  • 1 Citations
  • 1 h-Index
  • 2 Conference contribution

High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding

Tatsumi, K., Morisako, I., Wada, K., Fukuomori, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Hikita, M., Kamimura, R., Kawanabe, N., Sugiura, K., Tsuruta, K. & Toda, K., 2019 May, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1451-1456 6 p. 8811270. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)

    High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles

    Tatsumi, K., Tanaka, Y., Iizuka, T., Wada, K., Fukumori, M., Morisako, I., Jeongbin, Y. & Murakawa, N., 2018 Nov 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546378

    Research output: Chapter in Book/Report/Conference proceedingConference contribution