Khairi Faiz Muhammad

次席研究員(研究院講師)

  • 10 Citations
  • 2 h-Index
20162019

Research output per year

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Research Output

  • 10 Citations
  • 2 h-Index
  • 4 Conference contribution
  • 3 Article

Heatsink design using spiral-fins considering additive manufacturing

Otake, S., Tateishi, Y., Gohara, H., Kato, R., Ikeda, Y., Parque, V., Faiz, M. K., Yoshida, M. & Miyashita, T., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 46-51 6 p. 8733558. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering

    Yamamoto, T., Muhammad, K. F., Suga, T., Miyashita, T. & Yoshida, M., 2017 Dec 26, 2017 IEEE CPMT Symposium Japan, ICSJ 2017. Institute of Electrical and Electronics Engineers Inc., Vol. 2017-January. p. 139-140 2 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)
  • Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application

    Muhammad, K. F., Yamamoto, T. & Yoshida, M., 2017 Dec 26, 2017 IEEE CPMT Symposium Japan, ICSJ 2017. Institute of Electrical and Electronics Engineers Inc., Vol. 2017-January. p. 195-198 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 6 Citations (Scopus)