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Fingerprint Dive into the research topics where Kohei Tatsumi is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 1 Similar Profiles
Intermetallics Engineering & Materials Science
Soldering alloys Engineering & Materials Science
Wire Engineering & Materials Science
intermetallics Physics & Astronomy
Plating Engineering & Materials Science
Gold Engineering & Materials Science
Packaging Engineering & Materials Science
solders Physics & Astronomy

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Research Output 1986 2019

  • 530 Citations
  • 13 h-Index
  • 28 Article
  • 27 Conference contribution
  • 1 Chapter

Development and evaluation of SiC inverter using Ni micro plating bonding power module

Kawagoe, A., Itose, T., Imakiire, A., Kozako, M., Hikita, M., Tatsumi, K., Iizuka, T., Morisako, I., Sato, N., Shimizu, K., Ueda, K., Sugiura, K., Tsuruta, K. & Toda, K., 2019 Apr 1, 2019 IEEE International Workshop on Integrated Power Packaging, IWIPP 2019. Institute of Electrical and Electronics Engineers Inc., p. 36-39 4 p. 8799079. (2019 IEEE International Workshop on Integrated Power Packaging, IWIPP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plating
Silicon carbide
Insulated gate bipolar transistors (IGBT)
Packaging
Temperature

High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding

Tatsumi, K., Morisako, I., Wada, K., Fukuomori, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Hikita, M., Kamimura, R., Kawanabe, N., Sugiura, K., Tsuruta, K. & Toda, K., 2019 May 1, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1451-1456 6 p. 8811270. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Plating
Packaging
Nickel
Temperature
Lead

High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles

Tatsumi, K., Tanaka, Y., Iizuka, T., Wada, K., Fukumori, M., Morisako, I., Jeongbin, Y. & Murakawa, N., 2018 Nov 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546378

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electroplating
Silicon carbide
Temperature
Nickel
Plating
4 Citations (Scopus)

Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application

Tatsumi, K., Inagaki, M., Kamei, K., Iizuka, T., Narimatsu, H., Sato, N., Shimizu, K., Ueda, K., Imakire, A., Hikita, M., Kamimura, R., Sugiura, K., Tsuruta, K. & Toda, K., 2017 Aug 1, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc., p. 1316-1321 6 p. 7999851

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nickel
Mountings
Plating
Automobiles
Packaging

High-temperature-resistant interconnection by using Nickel Nano-particles for power devices packaging

Iizuka, T., Tanaka, Y., Kamei, K., Inagaki, M., Murakawa, N. & Tatsumi, K., 2017 May 26, International Symposium on Semiconductor Manufacturing, ISSM 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7934521

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Packaging
Nickel
Temperature
Electrodes
Substrates