• 583 Citations
  • 13 h-Index
1986 …2020

Research output per year

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Fingerprint Dive into the research topics where Kohei Tatsumi is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

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Research Output

  • 583 Citations
  • 13 h-Index
  • 28 Article
  • 23 Conference contribution
  • 5 Conference article
  • 4 Paper

An Embedded SiC Module with Using NMPB Interconnection for Chevron Shaped Cu Lead and Electrodes

Fukui, N., Koshiba, K., Miyazaki, I., Morisako, I., Iizuka, T., Itose, T., Hikita, M., Kamimura, R. & Tatsumi, K., 2020 Jun, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2226-2229 4 p. 9159375. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Mechanics of direct bonding: Splitting forces

    Zimin, Y., Ueda, T. & Tatsumi, K., 2020 Mar 1, In : Sensors and Actuators, A: Physical. 303, 111671.

    Research output: Contribution to journalArticle

  • Development and evaluation of SiC inverter using Ni micro plating bonding power module

    Kawagoe, A., Itose, T., Imakiire, A., Kozako, M., Hikita, M., Tatsumi, K., Iizuka, T., Morisako, I., Sato, N., Shimizu, K., Ueda, K., Sugiura, K., Tsuruta, K. & Toda, K., 2019 Apr 1, 2019 IEEE International Workshop on Integrated Power Packaging, IWIPP 2019. Institute of Electrical and Electronics Engineers Inc., p. 36-39 4 p. 8799079. (2019 IEEE International Workshop on Integrated Power Packaging, IWIPP 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)

    Electroluminescence of Epoxy Resin Nanocomposite under AC High Field

    Tohyama, K., Iizuka, T., Tatsumi, K., Otake, Y., Umemoto, T., Mabuchi, T. & Muto, H., 2019 Oct, 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 78-81 4 p. 9009674. (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP; vol. 2019-October).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding

    Tatsumi, K., Morisako, I., Wada, K., Fukuomori, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Hikita, M., Kamimura, R., Kawanabe, N., Sugiura, K., Tsuruta, K. & Toda, K., 2019 May, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1451-1456 6 p. 8811270. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)