• 571 Citations
  • 13 h-Index
1986 …2019

Research output per year

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Research Output

  • 571 Citations
  • 13 h-Index
  • 27 Article
  • 21 Conference contribution
  • 5 Conference article
  • 4 Paper
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Article
2019

Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding

Imakiire, A., Kozako, M., Hikita, M., Tatsumi, K., Inagaki, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Sugiura, K., Tsuruta, K. & Toda, K., 2019 Jan 1, In : ieej transactions on industry applications. 139, 10, p. 838-846 9 p.

Research output: Contribution to journalArticle

2017

Synthesis of SiC coating from SiO by a chemical vapor deposition (CVD) process

Murakawa, N., Eguchi, M. & Tatsumi, K., 2017 Mar 1, In : Nippon Seramikkusu Kyokai Gakujutsu Ronbunshi/Journal of the Ceramic Society of Japan. 125, 3, p. 85-87 3 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)
2014

Alloying behaviour of electroplated Ag film with its underlying Pd/Ti film stack for low resistivity interconnect metallization

Ezawa, H., Miyata, M. & Tatsumi, K., 2014 Jan 1, In : Journal of Alloys and Compounds. 587, p. 487-492 6 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)

Electrical properties of epoxy/POSS composites with homogeneous nanostructure

Huang, X., Li, Y., Liu, F., Jiang, P., Iizuka, T., Tatsumi, K. & Tanaka, T., 2014 Aug, In : IEEE Transactions on Dielectrics and Electrical Insulation. 21, 4, p. 1516-1528 13 p., 6877978.

Research output: Contribution to journalArticle

29 Citations (Scopus)

Role of interface in highly filled epoxy/BaTiO3 nanocomposites. Part I-correlation between nanoparticle surface chemistry and nanocomposite dielectric property

Huang, X., Xie, L., Yang, K., Wu, C., Jiang, P., Li, S., Wu, S., Tatsumi, K. & Tanaka, T., 2014 Apr, In : IEEE Transactions on Dielectrics and Electrical Insulation. 21, 2, p. 467-479 13 p., 6783037.

Research output: Contribution to journalArticle

37 Citations (Scopus)
31 Citations (Scopus)
2013

Process integration of fine pitch Cu redistribution wiring and SnCu micro-bumping for power efficient LSI devices with high-bandwidth stacked DRAM

Ezawa, H., Togasaki, T., Migita, T., Yamashita, S., Inohara, M., Koshio, Y., Fukuda, M., Miyata, M. & Tatsumi, K., 2013 Mar, In : Microelectronic Engineering. 103, p. 22-32 11 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Synthesis of nano-composite powder composed of silica and carbon and characteristic behavior at a high temperature thereof

Murakawa, N., Wang, M. & Tatsumi, K., 2013 Feb, In : Journal of the Ceramic Society of Japan. 121, 1410, p. 250-253 4 p.

Research output: Contribution to journalArticle

Open Access
2009

Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character

Terashima, S., Kohno, T., Mizusawa, A., Arai, K., Okada, O., Wakabayashi, T., Tanaka, M. & Tatsumi, K., 2009 Jan 1, In : Journal of Electronic Materials. 38, 1, p. 33-38 6 p.

Research output: Contribution to journalArticle

30 Citations (Scopus)

Investigation of heavily nitrogen-doped n+ 4H-SiC crystals grown by physical vapor transport

Ohtani, N., Katsuno, M., Nakabayashi, M., Fujimoto, T., Tsuge, H., Yashiro, H., Aigo, T., Hirano, H., Hoshino, T. & Tatsumi, K., 2009 Mar 1, In : Journal of Crystal Growth. 311, 6, p. 1475-1481 7 p.

Research output: Contribution to journalArticle

52 Citations (Scopus)
2008
17 Citations (Scopus)
2005

IMC growth of solid state reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag solder bump using ball place bumping method during aging

Ishikawa, S., Hashino, E., Kono, T. & Tatsumi, K., 2005 Nov 1, In : Materials Transactions. 46, 11, p. 2351-2358 8 p.

Research output: Contribution to journalArticle

17 Citations (Scopus)
2001

50 μm fine pitch ball bonding technology

Uno, T., Kitamura, O., Terashima, S. & Tatsumi, K., 2001 Jul 1, In : Nippon Steel Technical Report. 84, p. 24-29 6 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Improvement in thermal reliability of a flip chip interconnection system joined by Pb-free solder and Au bumps

Terashima, S., Uno, T., Hashino, E. & Tatsumi, K., 2001 Jan 1, In : Materials Transactions. 42, 5, p. 803-808 6 p.

Research output: Contribution to journalArticle

Open Access
11 Citations (Scopus)

Micro-ball bumping technology

Tatsumi, K., Yamamoto, Y., Hashino, E. & Shimokawa, K., 2001 Jul 1, In : Nippon Steel Technical Report. 84, p. 46-52 7 p.

Research output: Contribution to journalArticle

2000

Thermal reliability of gold - aluminum bonds encapsulated in bi-phenyl epoxy resin

Uno, T. & Tatsumi, K., 2000 Jan 14, In : Microelectronics Reliability. 40, 1, p. 145-153 9 p.

Research output: Contribution to journalArticle

45 Citations (Scopus)
1999

Corrosion of Intermetallic Layer and Reliability of Au/Al Bonds

Uno, T. & Tatsumi, K., 1999 Jan 1, In : Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals. 63, 3, p. 406-415 10 p.

Research output: Contribution to journalArticle

Open Access
9 Citations (Scopus)

Diffusion behavior and reliability in bonds between Au-Ag alloy and aluminum

Uno, T. & Tatsumi, K., 1999 Jan 1, In : Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals. 63, 12, p. 1545-1554 10 p.

Research output: Contribution to journalArticle

Open Access
1 Citation (Scopus)

Intermetallic growth and void formation in Au wire ball bonds to Al pads

Uno, T. & Tatsumi, K., 1999 Jan 1, In : Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals. 63, 7, p. 828-837 10 p.

Research output: Contribution to journalArticle

Open Access
10 Citations (Scopus)

Micro-ball bumping technology for flip chip and TAB interconnections

Tatsumi, K., Shimokawa, K., Hashino, E., Ohzeki, Y., Nakamori, T. & Tanaka, M., 1999 Jun 1, In : International Journal of Microcircuits and Electronic Packaging. 22, 2, p. 127-136 10 p.

Research output: Contribution to journalArticle

8 Citations (Scopus)
1997

Effects of Al 2O 3 films on the reliability of Au/Al joint

Tsuge, A., Uno, T., Mizuno, K. & Tatsumi, K., 1997 Jan 1, In : Nippon Steel Technical Report. 72, p. 95-101 7 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Fine-pitch wire ball bonding technology

Tatsumi, K., Onoue, K., Uno, T. & Kitamura, O., 1997 Apr, In : Nippon Steel Technical Report. 73, p. 39-44 6 p.

Research output: Contribution to journalArticle

Fine-pitch wire ball bonding technology

Tatsumi, K., Onoue, K., Uno, T. & Kitamura, O., 1997 Apr 1, In : Nippon Steel Technical Report. 73, p. 39-44 6 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)
1995

Gold diffusion and intermetallic formation in Au/Al2O3/Al film

Tsuge, A., Mizuno, K., Uno, T. & Tatsumi, K., 1995 Jan 1, In : Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals. 59, 11, p. 1095-1102 8 p.

Research output: Contribution to journalArticle

Open Access
9 Citations (Scopus)
1990

Lattice location of B atoms in Ni0.75Al0.15Ti0.10 intermetallic compounds as observed by the channeling method

Tanaka, K., Yagi, E., Masahashi, N., Mizuhara, Y., Tatsumi, K. & Takahari, T., 1990 Jan 2, In : Nuclear Inst. and Methods in Physics Research, B. 45, 1-4, p. 471-475 5 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)