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Fingerprint Dive into the research topics where Shuichi Shoji is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 6 Similar Profiles
Microfluidics Engineering & Materials Science
Fabrication Engineering & Materials Science
Microchannels Engineering & Materials Science
Sorting Engineering & Materials Science
Glass Engineering & Materials Science
Sensors Engineering & Materials Science
Vacuum Engineering & Materials Science
Temperature Engineering & Materials Science

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Research Output 1981 2019

1 Citation (Scopus)

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

Kuwae, H., Yamada, K., Momose, W., Shoji, S. & Mizuno, J., 2019 Apr 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Atomic layer deposition
Metalloids
Beer
Metals
Temperature
1 Citation (Scopus)

High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Aspect ratio
Resins
Thermosets
Fillers
Silica

High-Color-Purity Microfluidic Quantum Dots Light-Emitting Diodes Using the Electroluminescence of the Liquid Organic Semiconductor Backlight

Kawamura, M., Kuwae, H., Kamibayashi, T., Oshima, J., Kasahara, T., Shoji, S. & Mizuno, J., 2019 Jun 1, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 724-727 4 p. 8808557. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Organic Semiconductors
Electroluminescence
Semiconducting organic compounds
Microfluidics
organic semiconductors

High-Efficiency Dibromination of Organic Compound in Microfluidic Channel of SI Pillar Array Directly Coated with Iron Catalys

Sugaya, T., Tanaka, D., Yoon, D., Nozaki, Y., Sekiguchi, T., Akitsu, T. & Shoji, S., 2019 Jun 1, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 2278-2281 4 p. 8808687. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

microfluidic devices
International System of Units
Microfluidics
organic compounds
Organic compounds
1 Citation (Scopus)

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Atomic layer deposition
Platinum
Copper
Temperature
Ultrathin films