• 4699 Citations
  • 34 h-Index
1981 …2020

Research output per year

If you made any changes in Pure these will be visible here soon.

Fingerprint Dive into the research topics where Shuichi Shoji is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 3 Similar Profiles

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output

A micromachined liquid chromatography chip with a pillar array mixer for post-column derivatization in the analysis of neurotransmitters

Isokawa, M., Nakanishi, K., Kanamori, T., Zhuang, H., Yamazaki, H., Sugaya, T., Yoon, D. H., Sekiguchi, T., Funatsu, T., Shoji, S. & Tsunoda, M., 2020, 21st International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2017. Chemical and Biological Microsystems Society, p. 1318-1319 2 p. (21st International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • RGB all Liquid-Based Microfluidic Quantum Dots Light-Emitting Diodes Using Deep-Blue Liquid Organic Semiconductor Backlight

    Kawamura, M., Kuwae, H., Kamibayashi, T., Oshima, J., Kasahara, T., Shoji, S. & Mizuno, J., 2020 Jan, 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020. Institute of Electrical and Electronics Engineers Inc., p. 1238-1241 4 p. 9056181. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2020-January).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)

    Simple and Rapid Fabrication Process of Porous Silicon Surface Using Inductively Coupled Plasma Reactive Ion Etching

    Sugaya, T., Yoon, D. H., Yamazaki, H., Nakanishi, K., Sekiguchi, T. & Shoji, S., 2020 Feb, In : Journal of Microelectromechanical Systems. 29, 1, p. 62-67 6 p., 8910376.

    Research output: Contribution to journalArticle

  • Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

    Kuwae, H., Yamada, K., Momose, W., Shoji, S. & Mizuno, J., 2019 Apr, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)

    High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

    Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)