Tomonori Iizuka

講師(任期付)

  • 657 Citations
  • 12 h-Index
20072019

Research output per year

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Research Output

  • 657 Citations
  • 12 h-Index
  • 16 Conference contribution
  • 12 Article
  • 3 Conference article
  • 1 Paper

Development and evaluation of SiC inverter using Ni micro plating bonding power module

Kawagoe, A., Itose, T., Imakiire, A., Kozako, M., Hikita, M., Tatsumi, K., Iizuka, T., Morisako, I., Sato, N., Shimizu, K., Ueda, K., Sugiura, K., Tsuruta, K. & Toda, K., 2019 Apr 1, 2019 IEEE International Workshop on Integrated Power Packaging, IWIPP 2019. Institute of Electrical and Electronics Engineers Inc., p. 36-39 4 p. 8799079. (2019 IEEE International Workshop on Integrated Power Packaging, IWIPP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1 Citation (Scopus)

    High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding

    Tatsumi, K., Morisako, I., Wada, K., Fukuomori, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Hikita, M., Kamimura, R., Kawanabe, N., Sugiura, K., Tsuruta, K. & Toda, K., 2019 May, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1451-1456 6 p. 8811270. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding

    Imakiire, A., Kozako, M., Hikita, M., Tatsumi, K., Inagaki, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Sugiura, K., Tsuruta, K. & Toda, K., 2019 Jan 1, In : ieej transactions on industry applications. 139, 10, p. 838-846 9 p.

    Research output: Contribution to journalArticle

  • High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles

    Tatsumi, K., Tanaka, Y., Iizuka, T., Wada, K., Fukumori, M., Morisako, I., Jeongbin, Y. & Murakawa, N., 2018 Nov 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546378

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application

    Tatsumi, K., Inagaki, M., Kamei, K., Iizuka, T., Narimatsu, H., Sato, N., Shimizu, K., Ueda, K., Imakire, A., Hikita, M., Kamimura, R., Sugiura, K., Tsuruta, K. & Toda, K., 2017 Aug 1, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc., p. 1316-1321 6 p. 7999851. (Proceedings - Electronic Components and Technology Conference).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 7 Citations (Scopus)