Abstract
We have developed the novel 0.15μm CMOS processes for high performance and high reliability, consisting of mixing the CoSi2/Si interface using Si+ implantation to form shallow junctions, nitrogen implantation into gate electrodes to improve the oxide reliability, and selective channel implantation using a gate-around mask to reduce the junction capacitance. By using those processes, the propagation delay time of 21 psec/stage was obtained for 0.15μm CMOS ring oscillator at the allowable maximum supply voltage of 2.0 V limited by hot-carrier degradation.
| Original language | English |
|---|---|
| Pages (from-to) | 67-70 |
| Number of pages | 4 |
| Journal | Technical Digest - International Electron Devices Meeting |
| Publication status | Published - 1994 Dec 1 |
| Externally published | Yes |
| Event | Proceedings of the 1994 IEEE International Electron Devices Meeting - San Francisco, CA, USA Duration: 1994 Dec 11 → 1994 Dec 14 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry
Fingerprint Dive into the research topics of '0.15 μm CMOS process for high performance and high reliability'. Together they form a unique fingerprint.
Cite this
Shimizu, S., Kuroi, T., Kobayashi, M., Yamaguchi, T., Fujino, T., Maeda, H., Tsutsumi, T., Hirose, Y., Kusunoki, S., Inuishi, M., & Tsubouchi, N. (1994). 0.15 μm CMOS process for high performance and high reliability. Technical Digest - International Electron Devices Meeting, 67-70.