209mW 11Gbps 130GHz CMOS transceiver for indoor wireless communication

Kosuke Katayama, Mizuki Motoyoshi, Kyoya Takano, Li Chen Yang, Minoru Fujishima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

CMOS millimeter-wave transceivers have realized over 10Gbps communication for proximity communication within 10cm distance. To increase the communication distance for indoor applications, the output power of transmitters should be increased. However, it has been difficult to simultaneously realize high power efficiency together with low power consumption and the wideband required for 10Gbps communication in the power amplifiers used in transmitters. To realize 10Gbps communication for indoor applications with CMOS technology, the co-design of a modulator with low impedance variation and a wideband power amplifier is proposed by adopting amplitude-shift keying. The proposed transceiver is fabricated using a 40nm CMOS process, and is the first transceiver to realize 11Gbps with a communication distance of 3m and has a power consumption of 208.9mW. The transmitter realized maximum 2.8dBm output power with 77mW power consumption using a power amplifier with a 3dB bandwidth of 18GHz.

Original languageEnglish
Title of host publicationProceedings of the 2013 IEEE Asian Solid-State Circuits Conference, A-SSCC 2013
Pages409-412
Number of pages4
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2013 9th IEEE Asian Solid-State Circuits Conference, A-SSCC 2013 - Singapore
Duration: 2013 Nov 112013 Nov 13

Other

Other2013 9th IEEE Asian Solid-State Circuits Conference, A-SSCC 2013
CitySingapore
Period13/11/1113/11/13

Fingerprint

Transceivers
Communication
Power amplifiers
Transmitters
Electric power utilization
Broadband amplifiers
Millimeter waves
Modulators
Bandwidth

Keywords

  • ASK
  • CMOS
  • D-band
  • Millimeter-wave

ASJC Scopus subject areas

  • Hardware and Architecture

Cite this

Katayama, K., Motoyoshi, M., Takano, K., Yang, L. C., & Fujishima, M. (2013). 209mW 11Gbps 130GHz CMOS transceiver for indoor wireless communication. In Proceedings of the 2013 IEEE Asian Solid-State Circuits Conference, A-SSCC 2013 (pp. 409-412). [6691069] https://doi.org/10.1109/ASSCC.2013.6691069

209mW 11Gbps 130GHz CMOS transceiver for indoor wireless communication. / Katayama, Kosuke; Motoyoshi, Mizuki; Takano, Kyoya; Yang, Li Chen; Fujishima, Minoru.

Proceedings of the 2013 IEEE Asian Solid-State Circuits Conference, A-SSCC 2013. 2013. p. 409-412 6691069.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Katayama, K, Motoyoshi, M, Takano, K, Yang, LC & Fujishima, M 2013, 209mW 11Gbps 130GHz CMOS transceiver for indoor wireless communication. in Proceedings of the 2013 IEEE Asian Solid-State Circuits Conference, A-SSCC 2013., 6691069, pp. 409-412, 2013 9th IEEE Asian Solid-State Circuits Conference, A-SSCC 2013, Singapore, 13/11/11. https://doi.org/10.1109/ASSCC.2013.6691069
Katayama K, Motoyoshi M, Takano K, Yang LC, Fujishima M. 209mW 11Gbps 130GHz CMOS transceiver for indoor wireless communication. In Proceedings of the 2013 IEEE Asian Solid-State Circuits Conference, A-SSCC 2013. 2013. p. 409-412. 6691069 https://doi.org/10.1109/ASSCC.2013.6691069
Katayama, Kosuke ; Motoyoshi, Mizuki ; Takano, Kyoya ; Yang, Li Chen ; Fujishima, Minoru. / 209mW 11Gbps 130GHz CMOS transceiver for indoor wireless communication. Proceedings of the 2013 IEEE Asian Solid-State Circuits Conference, A-SSCC 2013. 2013. pp. 409-412
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