24-80 GHz, 0.024 mm2 miniaturized balun using defected ground structure for Si-based RF IC applications

Hang Xiao, Xin Yang, Toshihiko Yoshimasu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A compact broadband balun on a silicon substrate is proposed for millimeter-wave applications. By utilizing a novel defected ground structure, it is expected that the balun exhibits an amplitude balance less than 0.5 dB and a phase balance less than 2 degrees in a frequency range from 26 GHz to 80 GHz. The insertion loss is less than 3 dB in the operational frequency band. The balun achieves a bandwidth of 108 % and the area occupies only 0.024 mm2.

Original languageEnglish
Title of host publication2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479923342
DOIs
Publication statusPublished - 2014 Mar 13
Event2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014 - Chengdu, China
Duration: 2014 Jun 182014 Jun 20

Other

Other2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014
CountryChina
CityChengdu
Period14/6/1814/6/20

Fingerprint

Defected ground structures
Insertion losses
Millimeter waves
Frequency bands
Bandwidth
Silicon
Substrates

Keywords

  • Defected ground structure
  • Marchand balun
  • Millimeter-wave

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

Xiao, H., Yang, X., & Yoshimasu, T. (2014). 24-80 GHz, 0.024 mm2 miniaturized balun using defected ground structure for Si-based RF IC applications. In 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014 [7061228] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDSSC.2014.7061228

24-80 GHz, 0.024 mm2 miniaturized balun using defected ground structure for Si-based RF IC applications. / Xiao, Hang; Yang, Xin; Yoshimasu, Toshihiko.

2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. 7061228.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Xiao, H, Yang, X & Yoshimasu, T 2014, 24-80 GHz, 0.024 mm2 miniaturized balun using defected ground structure for Si-based RF IC applications. in 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014., 7061228, Institute of Electrical and Electronics Engineers Inc., 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014, Chengdu, China, 14/6/18. https://doi.org/10.1109/EDSSC.2014.7061228
Xiao H, Yang X, Yoshimasu T. 24-80 GHz, 0.024 mm2 miniaturized balun using defected ground structure for Si-based RF IC applications. In 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. 7061228 https://doi.org/10.1109/EDSSC.2014.7061228
Xiao, Hang ; Yang, Xin ; Yoshimasu, Toshihiko. / 24-80 GHz, 0.024 mm2 miniaturized balun using defected ground structure for Si-based RF IC applications. 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014. Institute of Electrical and Electronics Engineers Inc., 2014.
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