2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults

Khanh N. Dang*, Michael Conrad Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan Tu Tran

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs). However, the reliability issues due to the low yield rates, the sensitivity to thermal hotspots and stress issues due to the difference in temperature between layers are preventing TSV-based 3D-ICs from being widely and efficiently used. Due to defect clustering, 3D-ICs could have multiple defects in the same region which cannot be detected by using error correction codes while dedicated testing could take a significant number of testing cycles. This paper presents a 2D Parity Product Code (2D-PPC) with the ability to correct one fault and detect, at least, two faults. With the extension using Orthogonal Latin Square, 2D-PPC could detect multiple defects while reasonably increasing the area cost and latency.

Original languageEnglish
Title of host publicationProceedings - APCCAS 2019
Subtitle of host publication2019 IEEE Asia Pacific Conference on Circuits and Systems: Innovative CAS Towards Sustainable Energy and Technology Disruption
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages109-112
Number of pages4
ISBN (Electronic)9781728129402
DOIs
Publication statusPublished - 2019 Nov
Event15th Annual IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2019 - Bangkok, Thailand
Duration: 2019 Nov 112019 Nov 14

Publication series

NameProceedings - APCCAS 2019: 2019 IEEE Asia Pacific Conference on Circuits and Systems: Innovative CAS Towards Sustainable Energy and Technology Disruption

Conference

Conference15th Annual IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2019
Country/TerritoryThailand
CityBangkok
Period19/11/1119/11/14

Keywords

  • 3D-ICs
  • Error Correction Code
  • Fault Tolerance
  • Orthogonal Latin Square
  • Through Silicon Via

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Renewable Energy, Sustainability and the Environment
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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