300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB

K. Takano, Kosuke Katayama, S. Hara, R. Dong, K. Mizuno, K. Takahashi, A. Kasamatsu, T. Yoshida, S. Amakawa, M. Fujishima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately -13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.

LanguageEnglish
Title of host publicationRWS 2018 - Proceedings
Subtitle of host publication2018 IEEE Radio and Wireless Symposium
PublisherIEEE Computer Society
Pages154-156
Number of pages3
Volume2018-January
ISBN (Electronic)9781538607091
DOIs
Publication statusPublished - 2018 Feb 28
Externally publishedYes
Event2018 IEEE Radio and Wireless Symposium, RWS 2018 - Anaheim, United States
Duration: 2018 Jan 142018 Jan 17

Other

Other2018 IEEE Radio and Wireless Symposium, RWS 2018
CountryUnited States
CityAnaheim
Period18/1/1418/1/17

Fingerprint

Printed circuit boards
Transmitters
Waveguides
Glass
costs
Quadrature amplitude modulation
Electric lines
Bandwidth
Costs

Keywords

  • 300-GHz band
  • CMOS
  • Terahertz wave
  • Transmitter module
  • Waveguide transition
  • Wireless link

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Communication

Cite this

Takano, K., Katayama, K., Hara, S., Dong, R., Mizuno, K., Takahashi, K., ... Fujishima, M. (2018). 300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB. In RWS 2018 - Proceedings: 2018 IEEE Radio and Wireless Symposium (Vol. 2018-January, pp. 154-156). IEEE Computer Society. https://doi.org/10.1109/RWS.2018.8304972

300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB. / Takano, K.; Katayama, Kosuke; Hara, S.; Dong, R.; Mizuno, K.; Takahashi, K.; Kasamatsu, A.; Yoshida, T.; Amakawa, S.; Fujishima, M.

RWS 2018 - Proceedings: 2018 IEEE Radio and Wireless Symposium. Vol. 2018-January IEEE Computer Society, 2018. p. 154-156.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Takano, K, Katayama, K, Hara, S, Dong, R, Mizuno, K, Takahashi, K, Kasamatsu, A, Yoshida, T, Amakawa, S & Fujishima, M 2018, 300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB. in RWS 2018 - Proceedings: 2018 IEEE Radio and Wireless Symposium. vol. 2018-January, IEEE Computer Society, pp. 154-156, 2018 IEEE Radio and Wireless Symposium, RWS 2018, Anaheim, United States, 18/1/14. https://doi.org/10.1109/RWS.2018.8304972
Takano K, Katayama K, Hara S, Dong R, Mizuno K, Takahashi K et al. 300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB. In RWS 2018 - Proceedings: 2018 IEEE Radio and Wireless Symposium. Vol. 2018-January. IEEE Computer Society. 2018. p. 154-156 https://doi.org/10.1109/RWS.2018.8304972
Takano, K. ; Katayama, Kosuke ; Hara, S. ; Dong, R. ; Mizuno, K. ; Takahashi, K. ; Kasamatsu, A. ; Yoshida, T. ; Amakawa, S. ; Fujishima, M. / 300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB. RWS 2018 - Proceedings: 2018 IEEE Radio and Wireless Symposium. Vol. 2018-January IEEE Computer Society, 2018. pp. 154-156
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