3.5W HBT MMIC power amplifier module for mobile communications

Keiichi Sakuno, Masanori Akagi, Hiroya Sato, Masato Miyauchi, Masatomo Hasegawa, Toshihiko Yoshimasu, Shinji Hara

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

A 900MHz-band GaAs/GaAlAs HBT MMIC power amplifier module has been developed for mobile communications by using a novel assembly technique called BHS and an AIN package as the MMIC chip carrier. The power module gave a peak output power of 3.7W and a power-added efficiency of 54.5% with a +6V single supply voltage.

Original languageEnglish
Title of host publicationDigest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium
PublisherPubl by IEEE
Pages63-66
Number of pages4
ISBN (Print)0780314190
Publication statusPublished - 1994 Jan 1
EventProceedings of the IEEE 1994 Microwave and Millimeter-Wave Monolithic Circuits Symposium - San Diego, CA, USA
Duration: 1994 May 231994 May 25

Publication series

NameDigest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium
ISSN (Print)0074-8587

Other

OtherProceedings of the IEEE 1994 Microwave and Millimeter-Wave Monolithic Circuits Symposium
CitySan Diego, CA, USA
Period94/5/2394/5/25

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Sakuno, K., Akagi, M., Sato, H., Miyauchi, M., Hasegawa, M., Yoshimasu, T., & Hara, S. (1994). 3.5W HBT MMIC power amplifier module for mobile communications. In Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium (pp. 63-66). (Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium). Publ by IEEE.