3D integration of heterogeneous MEMS structures by stamping transfer

Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, Isao Shimoyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

We propose an integration method of heterogeneous micro-electro-mechanical- system (MEMS) structures by liftoff and stamping transfer using a poly-(dimethylsiloxane) (PDMS) sheet. Silicon structures fabricated on multiple wafers were lifted off by PDMS sheets, and integrated onto a single wafer by the stamping transfer with high yield (>90 %) and high accuracy (position error <500 nm). A two-dimensional (2D) integration and three-dimensional (3D) assembly of pyramid-like/inverted pyramid-like structures were demonstrated by our method. These demonstrations prove that our method enables us to integrate process-incompatible heterogeneous MEMS structures onto a single wafer.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages175-178
Number of pages4
Publication statusPublished - 2007
Externally publishedYes
Event20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe
Duration: 2007 Jan 212007 Jan 25

Other

Other20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
CityKobe
Period07/1/2107/1/25

Fingerprint

stamping
Stamping
Polydimethylsiloxane
wafers
pyramids
Silicon
position errors
Demonstrations
assembly
silicon
baysilon

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Onoe, H., Iwase, E., Matsumoto, K., & Shimoyama, I. (2007). 3D integration of heterogeneous MEMS structures by stamping transfer. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 175-178). [4433045]

3D integration of heterogeneous MEMS structures by stamping transfer. / Onoe, Hiroaki; Iwase, Eiji; Matsumoto, Kiyoshi; Shimoyama, Isao.

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2007. p. 175-178 4433045.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Onoe, H, Iwase, E, Matsumoto, K & Shimoyama, I 2007, 3D integration of heterogeneous MEMS structures by stamping transfer. in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)., 4433045, pp. 175-178, 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007, Kobe, 07/1/21.
Onoe H, Iwase E, Matsumoto K, Shimoyama I. 3D integration of heterogeneous MEMS structures by stamping transfer. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2007. p. 175-178. 4433045
Onoe, Hiroaki ; Iwase, Eiji ; Matsumoto, Kiyoshi ; Shimoyama, Isao. / 3D integration of heterogeneous MEMS structures by stamping transfer. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2007. pp. 175-178
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