400-Gb/s operation of flip-chip interconnection EADFB laser array module

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Hiroaki Sanjoh, Ryuzo Iga, Yuta Ueda, Wataru Kobayashi, Hiroyuki Ishii

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 x 50-Gb/s simultaneous operation.

Original languageEnglish
Title of host publicationOptical Fiber Communication Conference, OFC 2015
PublisherOSA - The Optical Society
ISBN (Electronic)9781557529374
Publication statusPublished - 2015 Mar 13
Externally publishedYes
EventOptical Fiber Communication Conference, OFC 2015 - Los Angeles, United States
Duration: 2015 Mar 222015 Mar 26

Other

OtherOptical Fiber Communication Conference, OFC 2015
CountryUnited States
CityLos Angeles
Period15/3/2215/3/26

Fingerprint

Naphazoline
laser arrays
Crosstalk
modules
chips
Lasers
crosstalk

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Computer Networks and Communications
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

Cite this

Kanazawa, S., Fujisawa, T., Takahata, K., Sanjoh, H., Iga, R., Ueda, Y., ... Ishii, H. (2015). 400-Gb/s operation of flip-chip interconnection EADFB laser array module. In Optical Fiber Communication Conference, OFC 2015 OSA - The Optical Society.

400-Gb/s operation of flip-chip interconnection EADFB laser array module. / Kanazawa, Shigeru; Fujisawa, Takeshi; Takahata, Kiyoto; Sanjoh, Hiroaki; Iga, Ryuzo; Ueda, Yuta; Kobayashi, Wataru; Ishii, Hiroyuki.

Optical Fiber Communication Conference, OFC 2015. OSA - The Optical Society, 2015.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kanazawa, S, Fujisawa, T, Takahata, K, Sanjoh, H, Iga, R, Ueda, Y, Kobayashi, W & Ishii, H 2015, 400-Gb/s operation of flip-chip interconnection EADFB laser array module. in Optical Fiber Communication Conference, OFC 2015. OSA - The Optical Society, Optical Fiber Communication Conference, OFC 2015, Los Angeles, United States, 15/3/22.
Kanazawa S, Fujisawa T, Takahata K, Sanjoh H, Iga R, Ueda Y et al. 400-Gb/s operation of flip-chip interconnection EADFB laser array module. In Optical Fiber Communication Conference, OFC 2015. OSA - The Optical Society. 2015
Kanazawa, Shigeru ; Fujisawa, Takeshi ; Takahata, Kiyoto ; Sanjoh, Hiroaki ; Iga, Ryuzo ; Ueda, Yuta ; Kobayashi, Wataru ; Ishii, Hiroyuki. / 400-Gb/s operation of flip-chip interconnection EADFB laser array module. Optical Fiber Communication Conference, OFC 2015. OSA - The Optical Society, 2015.
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