400-Gb/s operation of flip-chip interconnection EADFB laser array module

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Hiroaki Sanjoh, Ryuzo Iga, Yuta Ueda, Wataru Kobayashi, Hiroyuki Ishii

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 x 50-Gb/s simultaneous operation.

Original languageEnglish
Title of host publicationOptical Fiber Communication Conference, OFC 2015
PublisherOSA - The Optical Society
ISBN (Electronic)9781557529374
Publication statusPublished - 2015 Mar 13
Externally publishedYes
EventOptical Fiber Communication Conference, OFC 2015 - Los Angeles, United States
Duration: 2015 Mar 222015 Mar 26

Other

OtherOptical Fiber Communication Conference, OFC 2015
CountryUnited States
CityLos Angeles
Period15/3/2215/3/26

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Computer Networks and Communications
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

Cite this

Kanazawa, S., Fujisawa, T., Takahata, K., Sanjoh, H., Iga, R., Ueda, Y., Kobayashi, W., & Ishii, H. (2015). 400-Gb/s operation of flip-chip interconnection EADFB laser array module. In Optical Fiber Communication Conference, OFC 2015 OSA - The Optical Society.