TY - GEN
T1 - 400-Gb/s operation of flip-chip interconnection EADFB laser array module
AU - Kanazawa, Shigeru
AU - Fujisawa, Takeshi
AU - Takahata, Kiyoto
AU - Sanjoh, Hiroaki
AU - Iga, Ryuzo
AU - Ueda, Yuta
AU - Kobayashi, Wataru
AU - Ishii, Hiroyuki
N1 - Publisher Copyright:
© OSA 2015.
Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2015/3/13
Y1 - 2015/3/13
N2 - The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 x 50-Gb/s simultaneous operation.
AB - The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 x 50-Gb/s simultaneous operation.
UR - http://www.scopus.com/inward/record.url?scp=85050016992&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85050016992&partnerID=8YFLogxK
U2 - 10.1364/ofc.2015.tu3i.1
DO - 10.1364/ofc.2015.tu3i.1
M3 - Conference contribution
AN - SCOPUS:85050016992
T3 - Optical Fiber Communication Conference, OFC 2015
BT - Optical Fiber Communication Conference, OFC 2015
PB - OSA - The Optical Society
T2 - Optical Fiber Communication Conference, OFC 2015
Y2 - 22 March 2015 through 26 March 2015
ER -