400-Gb/s operation of flip-chip interconnection EADFB laser array module

Shigeru Kanazawa; Takeshi Fujisawa; Kiyoto Takahata; Hiroaki Sanjoh; Ryuzo Iga; Yuta Ueda; Wataru Kobayashi; Hiroyuki Ishii

doi:10.1364/ofc.2015.tu3i.1

400-Gb/s operation of flip-chip interconnection EADFB laser array module

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Hiroaki Sanjoh, Ryuzo Iga, Yuta Ueda, Wataru Kobayashi, Hiroyuki Ishii

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

16 Citations (Scopus)

Abstract

The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 x 50-Gb/s simultaneous operation.

Original language	English
Title of host publication	Optical Fiber Communication Conference, OFC 2015
Publisher	OSA - The Optical Society
ISBN (Electronic)	9781557529374
DOIs	https://doi.org/10.1364/ofc.2015.tu3i.1
Publication status	Published - 2015 Mar 13
Externally published	Yes
Event	Optical Fiber Communication Conference, OFC 2015 - Los Angeles, United States Duration: 2015 Mar 22 → 2015 Mar 26

Publication series

Name	Optical Fiber Communication Conference, OFC 2015

Other

Other	Optical Fiber Communication Conference, OFC 2015
Country/Territory	United States
City	Los Angeles
Period	15/3/22 → 15/3/26

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Computer Networks and Communications
Instrumentation
Atomic and Molecular Physics, and Optics

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10.1364/ofc.2015.tu3i.1

Cite this

Kanazawa, S, Fujisawa, T, Takahata, K, Sanjoh, H, Iga, R, Ueda, Y, Kobayashi, W & Ishii, H 2015, 400-Gb/s operation of flip-chip interconnection EADFB laser array module. in Optical Fiber Communication Conference, OFC 2015. Optical Fiber Communication Conference, OFC 2015, OSA - The Optical Society, Optical Fiber Communication Conference, OFC 2015, Los Angeles, United States, 15/3/22. https://doi.org/10.1364/ofc.2015.tu3i.1

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title = "400-Gb/s operation of flip-chip interconnection EADFB laser array module",

abstract = "The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 x 50-Gb/s simultaneous operation.",

author = "Shigeru Kanazawa and Takeshi Fujisawa and Kiyoto Takahata and Hiroaki Sanjoh and Ryuzo Iga and Yuta Ueda and Wataru Kobayashi and Hiroyuki Ishii",

note = "Publisher Copyright: {\textcopyright} OSA 2015. Copyright: Copyright 2020 Elsevier B.V., All rights reserved.; Optical Fiber Communication Conference, OFC 2015 ; Conference date: 22-03-2015 Through 26-03-2015",

year = "2015",

month = mar,

day = "13",

doi = "10.1364/ofc.2015.tu3i.1",

language = "English",

series = "Optical Fiber Communication Conference, OFC 2015",

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AU - Kanazawa, Shigeru

AU - Fujisawa, Takeshi

AU - Takahata, Kiyoto

AU - Sanjoh, Hiroaki

AU - Iga, Ryuzo

AU - Ueda, Yuta

AU - Kobayashi, Wataru

AU - Ishii, Hiroyuki

PY - 2015/3/13

Y1 - 2015/3/13

N2 - The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 x 50-Gb/s simultaneous operation.

AB - The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 x 50-Gb/s simultaneous operation.

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U2 - 10.1364/ofc.2015.tu3i.1

DO - 10.1364/ofc.2015.tu3i.1

M3 - Conference contribution

AN - SCOPUS:85050016992

T3 - Optical Fiber Communication Conference, OFC 2015

BT - Optical Fiber Communication Conference, OFC 2015

PB - OSA - The Optical Society

T2 - Optical Fiber Communication Conference, OFC 2015

Y2 - 22 March 2015 through 26 March 2015

ER -

400-Gb/s operation of flip-chip interconnection EADFB laser array module

Abstract

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