400-Gb/s operation of flip-chip interconnection EADFB laser array module

Shigeru Kanazawa; Takeshi Fujisawa; Kiyoto Takahata; Hiroaki Sanjoh; Ryuzo Iga; Yuta Ueda; Wataru Kobayashi; Hiroyuki Ishii

doi:10.1364/ofc.2015.tu3i.1

400-Gb/s operation of flip-chip interconnection EADFB laser array module

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Hiroaki Sanjoh, Ryuzo Iga, Yuta Ueda, Wataru Kobayashi, Hiroyuki Ishii

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

16 Citations (Scopus)

Abstract

The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 x 50-Gb/s simultaneous operation.

Original language	English
Title of host publication	Optical Fiber Communication Conference, OFC 2015
Publisher	OSA - The Optical Society
ISBN (Electronic)	9781557529374
DOIs	https://doi.org/10.1364/ofc.2015.tu3i.1
Publication status	Published - 2015 Mar 13
Externally published	Yes
Event	Optical Fiber Communication Conference, OFC 2015 - Los Angeles, United States Duration: 2015 Mar 22 → 2015 Mar 26

Publication series

Name	Optical Fiber Communication Conference, OFC 2015

Other

Other	Optical Fiber Communication Conference, OFC 2015
Country/Territory	United States
City	Los Angeles
Period	15/3/22 → 15/3/26

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Computer Networks and Communications
Instrumentation
Atomic and Molecular Physics, and Optics

Access to Document

10.1364/ofc.2015.tu3i.1

Cite this

400-Gb/s operation of flip-chip interconnection EADFB laser array module. / Kanazawa, Shigeru; Fujisawa, Takeshi; Takahata, Kiyoto; Sanjoh, Hiroaki; Iga, Ryuzo; Ueda, Yuta; Kobayashi, Wataru; Ishii, Hiroyuki.

Optical Fiber Communication Conference, OFC 2015. OSA - The Optical Society, 2015. (Optical Fiber Communication Conference, OFC 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kanazawa, S, Fujisawa, T, Takahata, K, Sanjoh, H, Iga, R, Ueda, Y, Kobayashi, W & Ishii, H 2015, 400-Gb/s operation of flip-chip interconnection EADFB laser array module. in Optical Fiber Communication Conference, OFC 2015. Optical Fiber Communication Conference, OFC 2015, OSA - The Optical Society, Optical Fiber Communication Conference, OFC 2015, Los Angeles, United States, 15/3/22. https://doi.org/10.1364/ofc.2015.tu3i.1

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abstract = "The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 x 50-Gb/s simultaneous operation.",

author = "Shigeru Kanazawa and Takeshi Fujisawa and Kiyoto Takahata and Hiroaki Sanjoh and Ryuzo Iga and Yuta Ueda and Wataru Kobayashi and Hiroyuki Ishii",

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AU - Iga, Ryuzo

AU - Ueda, Yuta

AU - Kobayashi, Wataru

AU - Ishii, Hiroyuki

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400-Gb/s operation of flip-chip interconnection EADFB laser array module

Abstract

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ASJC Scopus subject areas

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