50 GHz High Photocurrent PIN-PD and Its Thermal Effect

Yaofeng Yi*, Toshimasa Umezawa, Atsushi Kanno, Tetsuya Kawanishi

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We investigate the thermal effect of a PIN-PD with an extremely thin substrate that is fabricated via flip-chip bonding. This PIN-PD exhibits 30-mA of linear photocurrent and +14-dBm of RF output power at 50-GHz.

Original languageEnglish
Title of host publicationOECC/PSC 2022 - 27th OptoElectronics and Communications Conference/International Conference on Photonics in Switching and Computing 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9784885523366
DOIs
Publication statusPublished - 2022
Event27th OptoElectronics and Communications Conference/International Conference on Photonics in Switching and Computing, OECC/PSC 2022 - Toyama, Japan
Duration: 2022 Jul 32022 Jul 6

Publication series

NameOECC/PSC 2022 - 27th OptoElectronics and Communications Conference/International Conference on Photonics in Switching and Computing 2022

Conference

Conference27th OptoElectronics and Communications Conference/International Conference on Photonics in Switching and Computing, OECC/PSC 2022
Country/TerritoryJapan
CityToyama
Period22/7/322/7/6

Keywords

  • High RF Output Power
  • New Radio Band
  • PIN-PD
  • Thermal Analysis
  • Thin Substrate

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics

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