56-Gbaud 4-PAM (112-Gbit/s) operation of flip-chip interconnection lumped-electrode EADFB laser module for equalizer-free transmission

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, Hiroyuki Ishii, Hiroaki Sanjoh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

We fabricated a lumped-electrode type EADFB laser module using a flip-chip interconnection technique which provides a large modulation bandwidth. We obtained clear 56-Gbaud 4-PAM signal after 10-km SMF transmission with no equalizer using this module.

Original languageEnglish
Title of host publication2016 Optical Fiber Communications Conference and Exhibition, OFC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781943580071
Publication statusPublished - 2016 Aug 9
Externally publishedYes
Event2016 Optical Fiber Communications Conference and Exhibition, OFC 2016 - Anaheim, United States
Duration: 2016 Mar 202016 Mar 24

Other

Other2016 Optical Fiber Communications Conference and Exhibition, OFC 2016
CountryUnited States
CityAnaheim
Period16/3/2016/3/24

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Signal Processing
  • Atomic and Molecular Physics, and Optics

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    Kanazawa, S., Fujisawa, T., Takahata, K., Nakanishi, Y., Yamazaki, H., Ueda, Y., Kobayashi, W., Muramoto, Y., Ishii, H., & Sanjoh, H. (2016). 56-Gbaud 4-PAM (112-Gbit/s) operation of flip-chip interconnection lumped-electrode EADFB laser module for equalizer-free transmission. In 2016 Optical Fiber Communications Conference and Exhibition, OFC 2016 [7537846] Institute of Electrical and Electronics Engineers Inc..