8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique

S. Kanazawa, T. Fujisawa, Kiyoto Takahata, H. Sanjoh, R. Iga, H. Ishii

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We fabricated an eight-channel EADFB laser array sub-assembly using a flip-chip interconnection technique that provided a low crosstalk. We achieved clear eye openings for all eight lanes with 8 × 50-Gb/s simultaneous operation.

Original languageEnglish
Title of host publicationConference Digest - IEEE International Semiconductor Laser Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages58-59
Number of pages2
ISBN (Electronic)9781479957217
DOIs
Publication statusPublished - 2014 Dec 16
Externally publishedYes
Event2014 24th IEEE International Semiconductor Laser Conference, ISLC 2014 - Palma de Mallorca, Spain
Duration: 2014 Sep 72014 Sep 10

Other

Other2014 24th IEEE International Semiconductor Laser Conference, ISLC 2014
CountrySpain
CityPalma de Mallorca
Period14/9/714/9/10

Fingerprint

laser arrays
Crosstalk
crosstalk
assembly
chips
Lasers

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics

Cite this

Kanazawa, S., Fujisawa, T., Takahata, K., Sanjoh, H., Iga, R., & Ishii, H. (2014). 8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique. In Conference Digest - IEEE International Semiconductor Laser Conference (pp. 58-59). [6987449] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISLC.2014.162

8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique. / Kanazawa, S.; Fujisawa, T.; Takahata, Kiyoto; Sanjoh, H.; Iga, R.; Ishii, H.

Conference Digest - IEEE International Semiconductor Laser Conference. Institute of Electrical and Electronics Engineers Inc., 2014. p. 58-59 6987449.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kanazawa, S, Fujisawa, T, Takahata, K, Sanjoh, H, Iga, R & Ishii, H 2014, 8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique. in Conference Digest - IEEE International Semiconductor Laser Conference., 6987449, Institute of Electrical and Electronics Engineers Inc., pp. 58-59, 2014 24th IEEE International Semiconductor Laser Conference, ISLC 2014, Palma de Mallorca, Spain, 14/9/7. https://doi.org/10.1109/ISLC.2014.162
Kanazawa S, Fujisawa T, Takahata K, Sanjoh H, Iga R, Ishii H. 8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique. In Conference Digest - IEEE International Semiconductor Laser Conference. Institute of Electrical and Electronics Engineers Inc. 2014. p. 58-59. 6987449 https://doi.org/10.1109/ISLC.2014.162
Kanazawa, S. ; Fujisawa, T. ; Takahata, Kiyoto ; Sanjoh, H. ; Iga, R. ; Ishii, H. / 8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique. Conference Digest - IEEE International Semiconductor Laser Conference. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 58-59
@inproceedings{3678fe37e27244aa99398a915b805c47,
title = "8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique",
abstract = "We fabricated an eight-channel EADFB laser array sub-assembly using a flip-chip interconnection technique that provided a low crosstalk. We achieved clear eye openings for all eight lanes with 8 × 50-Gb/s simultaneous operation.",
author = "S. Kanazawa and T. Fujisawa and Kiyoto Takahata and H. Sanjoh and R. Iga and H. Ishii",
year = "2014",
month = "12",
day = "16",
doi = "10.1109/ISLC.2014.162",
language = "English",
pages = "58--59",
booktitle = "Conference Digest - IEEE International Semiconductor Laser Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

TY - GEN

T1 - 8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique

AU - Kanazawa, S.

AU - Fujisawa, T.

AU - Takahata, Kiyoto

AU - Sanjoh, H.

AU - Iga, R.

AU - Ishii, H.

PY - 2014/12/16

Y1 - 2014/12/16

N2 - We fabricated an eight-channel EADFB laser array sub-assembly using a flip-chip interconnection technique that provided a low crosstalk. We achieved clear eye openings for all eight lanes with 8 × 50-Gb/s simultaneous operation.

AB - We fabricated an eight-channel EADFB laser array sub-assembly using a flip-chip interconnection technique that provided a low crosstalk. We achieved clear eye openings for all eight lanes with 8 × 50-Gb/s simultaneous operation.

UR - http://www.scopus.com/inward/record.url?scp=84920149893&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84920149893&partnerID=8YFLogxK

U2 - 10.1109/ISLC.2014.162

DO - 10.1109/ISLC.2014.162

M3 - Conference contribution

AN - SCOPUS:84920149893

SP - 58

EP - 59

BT - Conference Digest - IEEE International Semiconductor Laser Conference

PB - Institute of Electrical and Electronics Engineers Inc.

ER -