8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique

S. Kanazawa, T. Fujisawa, K. Takahata, H. Sanjoh, R. Iga, H. Ishii

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We fabricated an eight-channel EADFB laser array sub-assembly using a flip-chip interconnection technique that provided a low crosstalk. We achieved clear eye openings for all eight lanes with 8 × 50-Gb/s simultaneous operation.

Original languageEnglish
Title of host publicationConference Digest - IEEE International Semiconductor Laser Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages58-59
Number of pages2
ISBN (Electronic)9781479957217
DOIs
Publication statusPublished - 2014 Dec 16
Externally publishedYes
Event2014 24th IEEE International Semiconductor Laser Conference, ISLC 2014 - Palma de Mallorca, Spain
Duration: 2014 Sep 72014 Sep 10

Publication series

NameConference Digest - IEEE International Semiconductor Laser Conference
ISSN (Print)0899-9406

Other

Other2014 24th IEEE International Semiconductor Laser Conference, ISLC 2014
CountrySpain
CityPalma de Mallorca
Period14/9/714/9/10

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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    Kanazawa, S., Fujisawa, T., Takahata, K., Sanjoh, H., Iga, R., & Ishii, H. (2014). 8 × 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique. In Conference Digest - IEEE International Semiconductor Laser Conference (pp. 58-59). [6987449] (Conference Digest - IEEE International Semiconductor Laser Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISLC.2014.162