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Conference contribution
Low Latency Online Source Separation and Noise Reduction Based on Joint Optimization with Dereverberation
Ueda, T., Nakatani, T., Ikeshita, R., Kinoshita, K., Araki, S. & Makino, S., 2021, 29th European Signal Processing Conference, EUSIPCO 2021 - Proceedings. European Signal Processing Conference, EUSIPCO, p. 1000-1004 5 p. (European Signal Processing Conference; vol. 2021-August).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low-loss and low-crosstalk all-fiber-based six-mode multiplexer and demultiplexer for mode-multiplexed QAM signals in C-band
Igarashi, K., Wakayama, Y., Soma, D., Tsuritani, T., Morita, I., Park, K. J., Ko, J. & Kim, B. Y., 2018, Optical Fiber Communication Conference, OFC 2018. OSA - The Optical Society, (Optics InfoBase Conference Papers; vol. Part F84-OFC 2018).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
Low-loss and low-crosstalk all-fiber-based six-mode multiplexer and demultiplexer for mode-multiplexed QAM signals in C-band
Igarashi, K., Wakayama, Y., Soma, D., Tsuritani, T., Morita, I., Park, K. J., Ko, J. & Kim, B. Y., 2018 Jun 13, 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
Low-loss optical coupling between polymer single-mode waveguide and single-mode fiber using 45° mirror
Kuwata, R., Su, Q., Oshima, H., Matsushima, Y., Ishikawa, H. & Utaka, K., 2022, OECC/PSC 2022 - 27th OptoElectronics and Communications Conference/International Conference on Photonics in Switching and Computing 2022. Institute of Electrical and Electronics Engineers Inc., (OECC/PSC 2022 - 27th OptoElectronics and Communications Conference/International Conference on Photonics in Switching and Computing 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low Loss ultra-compact Mach-Zehnder Modulator on Lithium Niobate Photonic Wire
Chunlen, J., Angkaew, T. & Kawanishi, T., 2019 Jul, OECC/PSC 2019 - 24th OptoElectronics and Communications Conference/International Conference Photonics in Switching and Computing 2019. Institute of Electrical and Electronics Engineers Inc., 8818155. (OECC/PSC 2019 - 24th OptoElectronics and Communications Conference/International Conference Photonics in Switching and Computing 2019).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low operating-energy directly modulated membrane distributed-reflector lasers on Si
Fujii, T., Takeda, K., Kanno, E., Hasebe, K., Nishi, H., Nakao, R., Yamamoto, T., Kakitsuka, T. & Matsuo, S., 2016, ECOC 2016; 42nd European Conference on Optical Communication. Institute of Electrical and Electronics Engineers Inc., p. 734-736 3 p. (European Conference on Optical Communication, ECOC).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
4 Citations (Scopus) -
Low-Operating Energy Heterogeneously Integrated Photonic-Crystal Laser on Si Waveguide
Nishi, H., Takeda, K., Fujii, T., Kuramochi, E., Shinya, A., Notomi, M., Tsuchizawa, T., Kakitsuka, T. & Matsuo, S., 2018 Oct 30, 26th International Semiconductor Laser Conference, ISLC 2018. Institute of Electrical and Electronics Engineers Inc., p. 77-78 2 p. 8516174. (Conference Digest - IEEE International Semiconductor Laser Conference; vol. 2018-September).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
Low-pass filter based VLSI oriented variable block size motion estimation algorithm for H.264
Zhenyu, L., Song, Y., Ikenaga, T. & Goto, S., 2006, 2006 IEEE International Conference on Acoustics, Speech, and Signal Processing - Proceedings. p. II253-II256 1660327. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings; vol. 2).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
7 Citations (Scopus) -
Low phase-delay reflection-type CRLH band-pass-filter
Nishino, T., Tsuru, M. & Miyazaki, M., 2006, Proceedings of the 36th European Microwave Conference, EuMC 2006. IEEE Computer Society, p. 745-748 4 p. 4057925. (Proceedings of the 36th European Microwave Conference, EuMC 2006).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
Low phase noise photonic millimeter-wave generation by using a reciprocating optical modulator
Kawanishi, T., Sakamoto, T., Shinada, S., Izutsu, M., Oikawa, S. & Yoshiara, K., 2004 Dec 1, Optical Fiber Communication Conference, OFC 2004 - Postconference Digest. p. 779-781 3 p. 1359652. (Conference on Optical Fiber Communication, Technical Digest Series; vol. 1).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
Low-power and high-speed operation of InGaAsP/InP photonic crystal nanocavity laser using wavelength-sized buried heterostructure
Shinya, A., Matsuo, S., Kakitsuka, T., Nozaki, K., Segawa, T., Sato, T., Kawaguchi, Y. & Notomi, M., 2010 Oct 11, Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference: 2010 Laser Science to Photonic Applications, CLEO/QELS 2010. 5500078. (Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference: 2010 Laser Science to Photonic Applications, CLEO/QELS 2010).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
Low-power and high-speed operation of InGaAsP/InP photonic crystal nanocavity laser using wavelength-sized buried heterostructure
Shinya, A., Matsuo, S., Kakitsuka, T., Nozaki, K., Segawa, T., Sato, T., Kawaguchi, Y. & Notomi, M., 2010, Conference on Lasers and Electro-Optics, CLEO 2010. Optical Society of America (OSA), (Optics InfoBase Conference Papers).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low-power and high-speed operation of InGaAsP/InP photonic crystal nanocavity laser using wavelength-sized buried heterostructure
Shinya, A., Matsuo, S., Kakitsuka, T., Nozaki, K., Segawa, T., Sato, T., Kawaguchi, Y. & Notomi, M., 2010 Dec 1, Conference on Lasers and Electro-Optics, CLEO 2010. (Optics InfoBase Conference Papers).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low power consumption Intelligent Local Avoided Collision (iLAC) MAC protocol for WLAN
Hieu, D. C., Van Tuan, L., Hieu, N. T., Masuda, A., Rabarijaona, V. H. & Shimamoto, S., 2012, 2012 IEEE International Symposium on Signal Processing and Information Technology, ISSPIT 2012. p. 1-6 6 p. 6621311. (2012 IEEE International Symposium on Signal Processing and Information Technology, ISSPIT 2012).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
Low power consumption optical switches for high- to low-end applications
Utaka, K., 2012 Dec 1, 2012 International Conference on Photonics in Switching, PS 2012. 6608343. (2012 International Conference on Photonics in Switching, PS 2012).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low power parallel encoding system for video surveillance applications
Jin, X., Ba, K. & Goto, S., 2010, 2010 International SoC Design Conference, ISOCC 2010. p. 229-232 4 p. 5682929Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
4 Citations (Scopus) -
Low power parallel surveillance video encoding system based on joint power-speed scheduling
Jin, X. & Goto, S., 2011, 2011 IEEE Visual Communications and Image Processing, VCIP 2011. 6115950Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low power surveillance video coding system
Jin, X., Ba, K. & Goto, S., 2010, 2010 IEEE International Conference on Multimedia and Expo, ICME 2010. p. 1156-1157 2 p. 5583167Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low power test compression technique for designs with multiple scan chains
Shi, Y., Togawa, N., Kimura, S., Yanagisawa, M. & Ohtsuki, T., 2005, Proceedings - 14th Asian Test Symposium, ATS 2005. p. 386-389 4 p. 1575460. (Proceedings of the Asian Test Symposium; vol. 2005).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
17 Citations (Scopus) -
Low-power ultra-wideband power detector IC in 130 nm CMOS technology
Yang, X., Uchida, Y., Liu, Q. & Yoshimasu, T., 2012 Dec 20, IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications, IMWS 2012 - Proceeding. p. 52-55 4 p. 6338206. (IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications, IMWS 2012 - Proceeding).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
Low profile double resonance frequency tunable antenna using RF MEMS variable capacitor for digital terrestrial broadcasting reception
Tsutsumi, Y., Nishio, M., Obayashi, S., Shoki, H., Ikehashi, T., Yamazaki, H., Ogawa, E., Saito, T., Ohguro, T. & Morooka, T., 2009, Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009. p. 125-128 4 p. 5357195. (Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
6 Citations (Scopus) -
Low-rankness of Complex-valued Spectrogram and Its Application to Phase-aware Audio Processing
Masuyama, Y., Yatabe, K. & Oikawa, Y., 2019 May, 2019 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 855-859 5 p. 8683100. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings; vol. 2019-May).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
14 Citations (Scopus) -
Low-rank tensor completion: A Riemannian manifold preconditioning approach
Kasai, H. & Mishra, B., 2016, 33rd International Conference on Machine Learning, ICML 2016. Weinberger, K. Q. & Balcan, M. F. (eds.). International Machine Learning Society (IMLS), p. 1576-1606 31 p. (33rd International Conference on Machine Learning, ICML 2016; vol. 3).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
33 Citations (Scopus) -
Low resolution character recognition by dual eigenspace and synthetic degraded patterns
Sun, J., Hotta, Y., Katsuyama, Y. & Naoi, S., 2004, HDP 2004: Proceedings of the First ACM Hardcopy Document Processing Workshop. Association for Computing Machinery (ACM), p. 15-22 8 p. (HDP 2004: Proceedings of the First ACM Hardcopy Document Processing Workshop).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
10 Citations (Scopus) -
Low-Resource Contextual Topic Identification on Speech
Liu, C., Wiesner, M., Watanabe, S., Harman, C., Trmal, J., Dehak, N. & Khudanpur, S., 2019 Feb 11, 2018 IEEE Spoken Language Technology Workshop, SLT 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 656-663 8 p. 8639544. (2018 IEEE Spoken Language Technology Workshop, SLT 2018 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
Low T/|W| dynamical instabilities in differentially rotating stars: Diagnosis with canonical angular momentum
Saijo, M. & Yoshida, SI., 2006, AIP Conference Proceedings. Vol. 861. p. 728-735 8 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering
Yamamoto, T., Faiz, M. K., Suga, T., Miyashita, T. & Yoshida, M., 2017 Dec 26, 2017 IEEE CPMT Symposium Japan, ICSJ 2017. Institute of Electrical and Electronics Engineers Inc., p. 139-140 2 p. (2017 IEEE CPMT Symposium Japan, ICSJ 2017; vol. 2017-January).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
Low-temperature, surface-compliant wafer bonding using sub-micron gold particles for wafer-level MEMS packaging
Ishida, H., Ogashiwa, T., Kanehira, Y., Ito, S., Yazaki, T. & Mizuno, J., 2012 Oct 4, 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012. p. 1140-1145 6 p. 6248979. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
8 Citations (Scopus) -
Low temperature all-Cu bonding via Cu-nanoparticle paste sintering in Pt-catalyzed formic acid vapor
Mu, F., Ren, H., Shin, S., Masatake, A., Liu, L., Zou, G., Makoto, Y. & Suga, T., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., p. 53 1 p. 8735224. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low temperature and low pressure bump bonding realized by single-micrometer Ag-nanoparticle bumps
Fu, W., Kasahara, T., Okada, A., Shoji, S., Shigetou, A. & Mizuno, J., 2014 Jan 1, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 1 p. 6886186. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application
Khairi Faiz, M., Yamamoto, T. & Yoshida, M., 2017 Dec 26, 2017 IEEE CPMT Symposium Japan, ICSJ 2017. Institute of Electrical and Electronics Engineers Inc., p. 195-198 4 p. (2017 IEEE CPMT Symposium Japan, ICSJ 2017; vol. 2017-January).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low-temperature anodic bonding of silicon and crystal quartz wafers for MEMS application
Zimin, Y. & Ueda, T., 2010, Proceedings of IEEE Sensors. p. 269-272 4 p. 5689857Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
6 Citations (Scopus) -
Low temperature Au-Au bonding with VUV/O 3 treatment
Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., Mizuno, J. & Shoji, S., 2011, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 6263015. (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low temperature Au-Au flip chip bonding with VUV/O 3 treatment for 3D integration
Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., Shoji, S. & Mizuno, J., 2012, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. p. 171 1 p. 6238082. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification
Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 Aug 16, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-August. p. 2541-2546 6 p. 7545784Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low-temperature bonding of a LiNbO3 waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices
Takigawa, R., Higurashi, E., Suga, T., Shinada, S. & Kawanishi, T., 2006 Dec 1, Optomechatronic Micro/Nano Devices and Components II. 637603. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6376).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
Low temperature bonding process using mixed Cu-Ag nanoparticles for electronic packaging
Zou, G., Yan, J., Wang, X., Mu, F., Bai, H., Wu, A., Hu, A. & Zhou, Y. N., 2011 Dec 1, Materials Science and Technology Conference and Exhibition 2011, MS and T'11. p. 1532-1538 7 p. (Materials Science and Technology Conference and Exhibition 2011, MS and T'11; vol. 2).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low temperature bonding using sub-micron Au particles for wafer-level MEMS packaging
Ito, S., Mizuno, J., Ishida, H., Ogashiwa, T., Kanehira, Y., Murai, H., Wakai, F. & Shoji, S., 2012 Dec 1, 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012. 6523451. (2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition
Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments
Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 302-305 4 p. 7486834. (2016 International Conference on Electronics Packaging, ICEP 2016).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low temperature direct bonding of polyether ether ketone (PEEK) and Pt
Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2015 Dec 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 217-220 4 p. 7365179Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)
Fu, W., Kuwae, H., Ma, B., Shoji, S. & Mizuno, J., 2017 Jun 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 167-170 4 p. 7939349Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low temperature direct bonding of single crystal quartz substrates for high performance optical low pass filter using amorphous SiO2 intermediate layers
Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 Feb 26, MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., p. 25-28 4 p. 7421548. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2016-February).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects
Mimatsu, H., Mizuno, J., Kasahara, T., Saito, M., Shoji, S. & Nishikawa, H., 2014, MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., p. 1131-1134 4 p. 6765845. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
7 Citations (Scopus) -
Low-temperature wafer bonding using sub-micron gold particles for wafer-level MEMS packaging
Ishida, H., Ogashiwa, T., Kanehira, Y., Ito, S., Yazaki, T. & Mizuno, J., 2012 Aug 15, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 1 p. 6238083. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Low-voltage operation of 100-Gbit/s EADFB laser array module
Kanazawa, S., Fujisawa, T., Ohki, A., Ishii, H., Nunoya, N., Kawaguchi, Y., Fujiwara, N., Takahata, K., Iga, R., Kano, F. & Oohashi, H., 2010 Dec 1, 2010 22nd IEEE International Semiconductor Laser Conference, ISLC 2010. p. 57-58 2 p. 5642753. (Conference Digest - IEEE International Semiconductor Laser Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
Low volume aerobic training heightens muscle deoxygenation in early post-angina pectoris patients
Takagi, S., Murase, N., Kime, R., Niwayama, M., Osada, T. & Katsumura, T., 2016, Oxygen Transport to Tissue XXXVIII. Springer New York LLC, Vol. 923. p. 255-261 7 p. (Advances in Experimental Medicine and Biology; vol. 923).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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LPE growth of low doped n-type 4H-SiC layer on on-axis substrate for power device application
Hattori, R., Kamei, K., Kusunoki, K., Yashiro, N. & Shimosaki, S., 2009, Materials Science Forum. Vol. 615 617. p. 141-144 4 p. (Materials Science Forum; vol. 615 617).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
LQG control for systems with scheduling parameter
Uchida, K., Watanabe, R. & Fujita, M., 2015 Mar 24, European Control Conference, ECC 1999 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 367-372 6 p. 7099330. (European Control Conference, ECC 1999 - Conference Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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L-shaped Method for the Stochastic Vehicle Routing Problem
Isomura, S., Sato, T., Shiina, T. & Imaizumi, J., 2019 Dec, 2019 IEEE International Conference on Industrial Engineering and Engineering Management, IEEM 2019. IEEE Computer Society, p. 591-595 5 p. 8978752. (IEEE International Conference on Industrial Engineering and Engineering Management).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution