A 105Gb/s 300GHz CMOS transmitter

Kyoya Takano, Shuhei Amakawa, Kosuke Katayama, Shinsuke Hara, Ruibing Dong, Akifumi Kasamatsu, Iwao Hosako, Koichi Mizuno, Kazuaki Takahashi, Takeshi Yoshida, Minoru Fujishima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

49 Citations (Scopus)

Abstract

'High speed' in communications often means 'high data-rate' and fiber-optic technologies have long been ahead of wireless technologies in that regard. However, an often overlooked definite advantage of wireless links over fiber-optic links is that waves travel at the speed of light c, which is about 50% faster than in optical fibers as shown in Fig. 17.9.1 (top left). This 'minimum latency' is crucial for applications requiring real-time responses over a long distance, including high-frequency trading [1]. Further opportunities and new applications might be created if the absolute minimum latency and fiber-optic data-rates are put together. (Sub-)THz frequencies have an extremely broad atmospheric transmission window with manageable losses as shown in Fig. 17.9.1 (top right) and will be ideal for building light-speed links supporting fiber-optic data-rates. This paper presents a 105Gb/s 300GHz transmitter (TX) fabricated using a 40nm CMOS process.

Original languageEnglish
Title of host publication2017 IEEE International Solid-State Circuits Conference, ISSCC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages308-309
Number of pages2
Volume60
ISBN (Electronic)9781509037575
DOIs
Publication statusPublished - 2017 Mar 2
Externally publishedYes
Event64th IEEE International Solid-State Circuits Conference, ISSCC 2017 - San Francisco, United States
Duration: 2017 Feb 52017 Feb 9

Other

Other64th IEEE International Solid-State Circuits Conference, ISSCC 2017
CountryUnited States
CitySan Francisco
Period17/2/517/2/9

Fingerprint

Fiber optics
Transmitters
Light velocity
Telecommunication links
Optical fibers
Communication

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Takano, K., Amakawa, S., Katayama, K., Hara, S., Dong, R., Kasamatsu, A., ... Fujishima, M. (2017). A 105Gb/s 300GHz CMOS transmitter. In 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017 (Vol. 60, pp. 308-309). [7870384] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2017.7870384

A 105Gb/s 300GHz CMOS transmitter. / Takano, Kyoya; Amakawa, Shuhei; Katayama, Kosuke; Hara, Shinsuke; Dong, Ruibing; Kasamatsu, Akifumi; Hosako, Iwao; Mizuno, Koichi; Takahashi, Kazuaki; Yoshida, Takeshi; Fujishima, Minoru.

2017 IEEE International Solid-State Circuits Conference, ISSCC 2017. Vol. 60 Institute of Electrical and Electronics Engineers Inc., 2017. p. 308-309 7870384.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Takano, K, Amakawa, S, Katayama, K, Hara, S, Dong, R, Kasamatsu, A, Hosako, I, Mizuno, K, Takahashi, K, Yoshida, T & Fujishima, M 2017, A 105Gb/s 300GHz CMOS transmitter. in 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017. vol. 60, 7870384, Institute of Electrical and Electronics Engineers Inc., pp. 308-309, 64th IEEE International Solid-State Circuits Conference, ISSCC 2017, San Francisco, United States, 17/2/5. https://doi.org/10.1109/ISSCC.2017.7870384
Takano K, Amakawa S, Katayama K, Hara S, Dong R, Kasamatsu A et al. A 105Gb/s 300GHz CMOS transmitter. In 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017. Vol. 60. Institute of Electrical and Electronics Engineers Inc. 2017. p. 308-309. 7870384 https://doi.org/10.1109/ISSCC.2017.7870384
Takano, Kyoya ; Amakawa, Shuhei ; Katayama, Kosuke ; Hara, Shinsuke ; Dong, Ruibing ; Kasamatsu, Akifumi ; Hosako, Iwao ; Mizuno, Koichi ; Takahashi, Kazuaki ; Yoshida, Takeshi ; Fujishima, Minoru. / A 105Gb/s 300GHz CMOS transmitter. 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017. Vol. 60 Institute of Electrical and Electronics Engineers Inc., 2017. pp. 308-309
@inproceedings{4d477612208e4ce6b31e79f243ee7b63,
title = "A 105Gb/s 300GHz CMOS transmitter",
abstract = "'High speed' in communications often means 'high data-rate' and fiber-optic technologies have long been ahead of wireless technologies in that regard. However, an often overlooked definite advantage of wireless links over fiber-optic links is that waves travel at the speed of light c, which is about 50{\%} faster than in optical fibers as shown in Fig. 17.9.1 (top left). This 'minimum latency' is crucial for applications requiring real-time responses over a long distance, including high-frequency trading [1]. Further opportunities and new applications might be created if the absolute minimum latency and fiber-optic data-rates are put together. (Sub-)THz frequencies have an extremely broad atmospheric transmission window with manageable losses as shown in Fig. 17.9.1 (top right) and will be ideal for building light-speed links supporting fiber-optic data-rates. This paper presents a 105Gb/s 300GHz transmitter (TX) fabricated using a 40nm CMOS process.",
author = "Kyoya Takano and Shuhei Amakawa and Kosuke Katayama and Shinsuke Hara and Ruibing Dong and Akifumi Kasamatsu and Iwao Hosako and Koichi Mizuno and Kazuaki Takahashi and Takeshi Yoshida and Minoru Fujishima",
year = "2017",
month = "3",
day = "2",
doi = "10.1109/ISSCC.2017.7870384",
language = "English",
volume = "60",
pages = "308--309",
booktitle = "2017 IEEE International Solid-State Circuits Conference, ISSCC 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

TY - GEN

T1 - A 105Gb/s 300GHz CMOS transmitter

AU - Takano, Kyoya

AU - Amakawa, Shuhei

AU - Katayama, Kosuke

AU - Hara, Shinsuke

AU - Dong, Ruibing

AU - Kasamatsu, Akifumi

AU - Hosako, Iwao

AU - Mizuno, Koichi

AU - Takahashi, Kazuaki

AU - Yoshida, Takeshi

AU - Fujishima, Minoru

PY - 2017/3/2

Y1 - 2017/3/2

N2 - 'High speed' in communications often means 'high data-rate' and fiber-optic technologies have long been ahead of wireless technologies in that regard. However, an often overlooked definite advantage of wireless links over fiber-optic links is that waves travel at the speed of light c, which is about 50% faster than in optical fibers as shown in Fig. 17.9.1 (top left). This 'minimum latency' is crucial for applications requiring real-time responses over a long distance, including high-frequency trading [1]. Further opportunities and new applications might be created if the absolute minimum latency and fiber-optic data-rates are put together. (Sub-)THz frequencies have an extremely broad atmospheric transmission window with manageable losses as shown in Fig. 17.9.1 (top right) and will be ideal for building light-speed links supporting fiber-optic data-rates. This paper presents a 105Gb/s 300GHz transmitter (TX) fabricated using a 40nm CMOS process.

AB - 'High speed' in communications often means 'high data-rate' and fiber-optic technologies have long been ahead of wireless technologies in that regard. However, an often overlooked definite advantage of wireless links over fiber-optic links is that waves travel at the speed of light c, which is about 50% faster than in optical fibers as shown in Fig. 17.9.1 (top left). This 'minimum latency' is crucial for applications requiring real-time responses over a long distance, including high-frequency trading [1]. Further opportunities and new applications might be created if the absolute minimum latency and fiber-optic data-rates are put together. (Sub-)THz frequencies have an extremely broad atmospheric transmission window with manageable losses as shown in Fig. 17.9.1 (top right) and will be ideal for building light-speed links supporting fiber-optic data-rates. This paper presents a 105Gb/s 300GHz transmitter (TX) fabricated using a 40nm CMOS process.

UR - http://www.scopus.com/inward/record.url?scp=85016288438&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85016288438&partnerID=8YFLogxK

U2 - 10.1109/ISSCC.2017.7870384

DO - 10.1109/ISSCC.2017.7870384

M3 - Conference contribution

AN - SCOPUS:85016288438

VL - 60

SP - 308

EP - 309

BT - 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017

PB - Institute of Electrical and Electronics Engineers Inc.

ER -