@inproceedings{85794dfb3912466f9e0d73c8a288cc57,
title = "A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si",
abstract = "A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.",
author = "Toshiki Kishi and Munehiko Nagatani and Shigeru Kanazawa and Shinsuke Nakano and Hiroaki Katsurai and Takuro Fujii and Hidetaka Nishi and Takaaki Kakitsuka and Koichi Hasebe and Kota Shikama and Yuko Kawajiri and Atsushi Aratake and Hideyuki Nosaka and Hiroshi Fukuda and Shinji Matsuo",
year = "2018",
month = jun,
day = "13",
language = "English",
series = "2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1--3",
booktitle = "2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings",
note = "2018 Optical Fiber Communications Conference and Exposition, OFC 2018 ; Conference date: 11-03-2018 Through 15-03-2018",
}