Abstract
A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.
| Original language | English |
|---|---|
| Title of host publication | 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1-3 |
| Number of pages | 3 |
| ISBN (Electronic) | 9781943580385 |
| Publication status | Published - 2018 Jun 13 |
| Externally published | Yes |
| Event | 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - San Diego, United States Duration: 2018 Mar 11 → 2018 Mar 15 |
Publication series
| Name | 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings |
|---|
Other
| Other | 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 |
|---|---|
| Country | United States |
| City | San Diego |
| Period | 18/3/11 → 18/3/15 |
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ASJC Scopus subject areas
- Computer Networks and Communications
- Hardware and Architecture
- Signal Processing
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Electrical and Electronic Engineering
Cite this
A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. / Kishi, Toshiki; Nagatani, Munehiko; Kanazawa, Shigeru; Nakano, Shinsuke; Katsurai, Hiroaki; Fujii, Takuro; Nishi, Hidetaka; Kakitsuka, Takaaki; Hasebe, Koichi; Shikama, Kota; Kawajiri, Yuko; Aratake, Atsushi; Nosaka, Hideyuki; Fukuda, Hiroshi; Matsuo, Shinji.
2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-3 (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si
AU - Kishi, Toshiki
AU - Nagatani, Munehiko
AU - Kanazawa, Shigeru
AU - Nakano, Shinsuke
AU - Katsurai, Hiroaki
AU - Fujii, Takuro
AU - Nishi, Hidetaka
AU - Kakitsuka, Takaaki
AU - Hasebe, Koichi
AU - Shikama, Kota
AU - Kawajiri, Yuko
AU - Aratake, Atsushi
AU - Nosaka, Hideyuki
AU - Fukuda, Hiroshi
AU - Matsuo, Shinji
PY - 2018/6/13
Y1 - 2018/6/13
N2 - A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.
AB - A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.
UR - http://www.scopus.com/inward/record.url?scp=85050026425&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85050026425&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85050026425
T3 - 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings
SP - 1
EP - 3
BT - 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
ER -