A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si

Toshiki Kishi*, Munehiko Nagatani, Shigeru Kanazawa, Shinsuke Nakano, Hiroaki Katsurai, Takuro Fujii, Hidetaka Nishi, Takaaki Kakitsuka, Koichi Hasebe, Kota Shikama, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, Shinji Matsuo

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.

Original languageEnglish
Title of host publication2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-3
Number of pages3
ISBN (Electronic)9781943580385
Publication statusPublished - 2018 Jun 13
Externally publishedYes
Event2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - San Diego, United States
Duration: 2018 Mar 112018 Mar 15

Publication series

Name2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings

Other

Other2018 Optical Fiber Communications Conference and Exposition, OFC 2018
Country/TerritoryUnited States
CitySan Diego
Period18/3/1118/3/15

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Signal Processing
  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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