A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si

Toshiki Kishi, Munehiko Nagatani, Shigeru Kanazawa, Shinsuke Nakano, Hiroaki Katsurai, Takuro Fujii, Hidetaka Nishi, Takaaki Kakitsuka, Koichi Hasebe, Kota Shikama, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, Shinji Matsuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.

Original languageEnglish
Title of host publication2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-3
Number of pages3
ISBN (Electronic)9781943580385
Publication statusPublished - 2018 Jun 13
Externally publishedYes
Event2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - San Diego, United States
Duration: 2018 Mar 112018 Mar 15

Publication series

Name2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings

Other

Other2018 Optical Fiber Communications Conference and Exposition, OFC 2018
CountryUnited States
CitySan Diego
Period18/3/1118/3/15

Fingerprint

transmitters
Transmitters
Electric power utilization
chips
shunts
CMOS

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Signal Processing
  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

Cite this

Kishi, T., Nagatani, M., Kanazawa, S., Nakano, S., Katsurai, H., Fujii, T., ... Matsuo, S. (2018). A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. In 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings (pp. 1-3). (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings). Institute of Electrical and Electronics Engineers Inc..

A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. / Kishi, Toshiki; Nagatani, Munehiko; Kanazawa, Shigeru; Nakano, Shinsuke; Katsurai, Hiroaki; Fujii, Takuro; Nishi, Hidetaka; Kakitsuka, Takaaki; Hasebe, Koichi; Shikama, Kota; Kawajiri, Yuko; Aratake, Atsushi; Nosaka, Hideyuki; Fukuda, Hiroshi; Matsuo, Shinji.

2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-3 (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kishi, T, Nagatani, M, Kanazawa, S, Nakano, S, Katsurai, H, Fujii, T, Nishi, H, Kakitsuka, T, Hasebe, K, Shikama, K, Kawajiri, Y, Aratake, A, Nosaka, H, Fukuda, H & Matsuo, S 2018, A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. in 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 1-3, 2018 Optical Fiber Communications Conference and Exposition, OFC 2018, San Diego, United States, 18/3/11.
Kishi T, Nagatani M, Kanazawa S, Nakano S, Katsurai H, Fujii T et al. A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. In 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1-3. (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).
Kishi, Toshiki ; Nagatani, Munehiko ; Kanazawa, Shigeru ; Nakano, Shinsuke ; Katsurai, Hiroaki ; Fujii, Takuro ; Nishi, Hidetaka ; Kakitsuka, Takaaki ; Hasebe, Koichi ; Shikama, Kota ; Kawajiri, Yuko ; Aratake, Atsushi ; Nosaka, Hideyuki ; Fukuda, Hiroshi ; Matsuo, Shinji. / A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1-3 (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).
@inproceedings{85794dfb3912466f9e0d73c8a288cc57,
title = "A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si",
abstract = "A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.",
author = "Toshiki Kishi and Munehiko Nagatani and Shigeru Kanazawa and Shinsuke Nakano and Hiroaki Katsurai and Takuro Fujii and Hidetaka Nishi and Takaaki Kakitsuka and Koichi Hasebe and Kota Shikama and Yuko Kawajiri and Atsushi Aratake and Hideyuki Nosaka and Hiroshi Fukuda and Shinji Matsuo",
year = "2018",
month = "6",
day = "13",
language = "English",
series = "2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1--3",
booktitle = "2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings",

}

TY - GEN

T1 - A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si

AU - Kishi, Toshiki

AU - Nagatani, Munehiko

AU - Kanazawa, Shigeru

AU - Nakano, Shinsuke

AU - Katsurai, Hiroaki

AU - Fujii, Takuro

AU - Nishi, Hidetaka

AU - Kakitsuka, Takaaki

AU - Hasebe, Koichi

AU - Shikama, Kota

AU - Kawajiri, Yuko

AU - Aratake, Atsushi

AU - Nosaka, Hideyuki

AU - Fukuda, Hiroshi

AU - Matsuo, Shinji

PY - 2018/6/13

Y1 - 2018/6/13

N2 - A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.

AB - A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.

UR - http://www.scopus.com/inward/record.url?scp=85050026425&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85050026425&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:85050026425

T3 - 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings

SP - 1

EP - 3

BT - 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

ER -