A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si

Toshiki Kishi, Munehiko Nagatani, Shigeru Kanazawa, Shinsuke Nakano, Hiroaki Katsurai, Takuro Fujii, Hidetaka Nishi, Takaaki Kakitsuka, Koichi Hasebe, Kota Shikama, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, Shinji Matsuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.

Original languageEnglish
Title of host publication2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-3
Number of pages3
ISBN (Electronic)9781943580385
Publication statusPublished - 2018 Jun 13
Externally publishedYes
Event2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - San Diego, United States
Duration: 2018 Mar 112018 Mar 15

Publication series

Name2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings

Other

Other2018 Optical Fiber Communications Conference and Exposition, OFC 2018
CountryUnited States
CitySan Diego
Period18/3/1118/3/15

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Signal Processing
  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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