A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si

Toshiki Kishi; Munehiko Nagatani; Shigeru Kanazawa; Shinsuke Nakano; Hiroaki Katsurai; Takuro Fujii; Hidetaka Nishi; Takaaki Kakitsuka; Koichi Hasebe; Kota Shikama; Yuko Kawajiri; Atsushi Aratake; Hideyuki Nosaka; Hiroshi Fukuda; Shinji Matsuo

A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si

Toshiki Kishi^*, Munehiko Nagatani, Shigeru Kanazawa, Shinsuke Nakano, Hiroaki Katsurai, Takuro Fujii, Hidetaka Nishi, Takaaki Kakitsuka, Koichi Hasebe, Kota Shikama, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, Shinji Matsuo

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.

Original language	English
Title of host publication	2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-3
Number of pages	3
ISBN (Electronic)	9781943580385
Publication status	Published - 2018 Jun 13
Externally published	Yes
Event	2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - San Diego, United States Duration: 2018 Mar 11 → 2018 Mar 15

Publication series

Name	2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings

Other

Other	2018 Optical Fiber Communications Conference and Exposition, OFC 2018
Country/Territory	United States
City	San Diego
Period	18/3/11 → 18/3/15

ASJC Scopus subject areas

Computer Networks and Communications
Hardware and Architecture
Signal Processing
Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

Cite this

Kishi, T., Nagatani, M., Kanazawa, S., Nakano, S., Katsurai, H., Fujii, T., Nishi, H., Kakitsuka, T., Hasebe, K., Shikama, K., Kawajiri, Y., Aratake, A., Nosaka, H., Fukuda, H., & Matsuo, S. (2018). A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. In 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings (pp. 1-3). (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings). Institute of Electrical and Electronics Engineers Inc..

A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. / Kishi, Toshiki; Nagatani, Munehiko; Kanazawa, Shigeru; Nakano, Shinsuke; Katsurai, Hiroaki; Fujii, Takuro; Nishi, Hidetaka; Kakitsuka, Takaaki; Hasebe, Koichi; Shikama, Kota; Kawajiri, Yuko; Aratake, Atsushi; Nosaka, Hideyuki; Fukuda, Hiroshi; Matsuo, Shinji.

2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-3 (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kishi, T, Nagatani, M, Kanazawa, S, Nakano, S, Katsurai, H, Fujii, T, Nishi, H, Kakitsuka, T, Hasebe, K, Shikama, K, Kawajiri, Y, Aratake, A, Nosaka, H, Fukuda, H & Matsuo, S 2018, A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. in 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 1-3, 2018 Optical Fiber Communications Conference and Exposition, OFC 2018, San Diego, United States, 18/3/11.

Kishi T, Nagatani M, Kanazawa S, Nakano S, Katsurai H, Fujii T et al. A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. In 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1-3. (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).

Kishi, Toshiki ; Nagatani, Munehiko ; Kanazawa, Shigeru ; Nakano, Shinsuke ; Katsurai, Hiroaki ; Fujii, Takuro ; Nishi, Hidetaka ; Kakitsuka, Takaaki ; Hasebe, Koichi ; Shikama, Kota ; Kawajiri, Yuko ; Aratake, Atsushi ; Nosaka, Hideyuki ; Fukuda, Hiroshi ; Matsuo, Shinji. / A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1-3 (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).

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abstract = "A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.",

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AU - Nakano, Shinsuke

AU - Katsurai, Hiroaki

AU - Fujii, Takuro

AU - Nishi, Hidetaka

AU - Kakitsuka, Takaaki

AU - Hasebe, Koichi

AU - Shikama, Kota

AU - Kawajiri, Yuko

AU - Aratake, Atsushi

AU - Nosaka, Hideyuki

AU - Fukuda, Hiroshi

AU - Matsuo, Shinji

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A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si

Abstract

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Other

ASJC Scopus subject areas

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