A 137-mW, 4 ch x 25-Gbps low-power compact transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si

Toshiki Kishi, Munehiko Nagatani, Shigeru Kanazawa, Shinsuke Nakano, Hiroaki Katsurai, Takuro Fujii, Hidetaka Nishi, Takaaki Kakitsuka, Koichi Hasebe, Kota Shikama, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, Shinji Matsuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.

Original languageEnglish
Title of host publicationOptical Fiber Communication Conference, OFC 2018
PublisherOSA - The Optical Society
ISBN (Electronic)9781557528209
DOIs
Publication statusPublished - 2018 Jan 1
Externally publishedYes
EventOptical Fiber Communication Conference, OFC 2018 - San Diego, United States
Duration: 2017 Mar 112017 Mar 15

Publication series

NameOptics InfoBase Conference Papers
VolumePart F84-OFC 2018

Other

OtherOptical Fiber Communication Conference, OFC 2018
CountryUnited States
CitySan Diego
Period17/3/1117/3/15

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials

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  • Cite this

    Kishi, T., Nagatani, M., Kanazawa, S., Nakano, S., Katsurai, H., Fujii, T., Nishi, H., Kakitsuka, T., Hasebe, K., Shikama, K., Kawajiri, Y., Aratake, A., Nosaka, H., Fukuda, H., & Matsuo, S. (2018). A 137-mW, 4 ch x 25-Gbps low-power compact transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si. In Optical Fiber Communication Conference, OFC 2018 (Optics InfoBase Conference Papers; Vol. Part F84-OFC 2018). OSA - The Optical Society. https://doi.org/10.1364/OFC.2018.M2D.2