A 137-mW, 4 ch x 25-Gbps low-power compact transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si

Toshiki Kishi*, Munehiko Nagatani, Shigeru Kanazawa, Shinsuke Nakano, Hiroaki Katsurai, Takuro Fujii, Hidetaka Nishi, Takaaki Kakitsuka, Koichi Hasebe, Kota Shikama, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, Shinji Matsuo

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.

Original languageEnglish
Title of host publicationOptical Fiber Communication Conference, OFC 2018
PublisherOSA - The Optical Society
ISBN (Electronic)9781557528209
DOIs
Publication statusPublished - 2018
Externally publishedYes
EventOptical Fiber Communication Conference, OFC 2018 - San Diego, United States
Duration: 2017 Mar 112017 Mar 15

Publication series

NameOptics InfoBase Conference Papers
VolumePart F84-OFC 2018

Other

OtherOptical Fiber Communication Conference, OFC 2018
Country/TerritoryUnited States
CitySan Diego
Period17/3/1117/3/15

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials

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