A triple-CPU mobile application processor is developed on an 8.95mm×8.95mm die in a 0.1μm CMOS process. The IC integrates 3×ARM926 cores, a DSP, several accelerators, as well as strong bus and memory interfaces. It consumes 120mW for digital TV, web browser, and 3D graphics, and 250mW@200MHz for 600MIPS with full processing.
|Journal||Digest of Technical Papers - IEEE International Solid-State Circuits Conference|
|Publication status||Published - 2005|
|Event||2005 IEEE International Solid-State Circuits Conference, ISSCC - San Francisco, CA, United States|
Duration: 2005 Feb 6 → 2005 Feb 10
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering