A 600MIPS 120mW 70μA leakage triple-CPU mobile application processor chip

S. Torii, S. Suzuki, H. Tomonaga, T. Tokue, J. Sakai, N. Suzuki, K. Murakami, T. Hiraga, K. Shigemoto, Y. Tatebe, E. Ohbuchi, N. Kayama, M. Edahiro, T. Kusano, N. Nishi

Research output: Contribution to journalConference article

35 Citations (Scopus)
Original languageEnglish
Pages (from-to)136-137+589
JournalDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume48
Publication statusPublished - 2005
Externally publishedYes
Event2005 IEEE International Solid-State Circuits Conference, ISSCC - San Francisco, CA, United States
Duration: 2005 Feb 62005 Feb 10

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Torii, S., Suzuki, S., Tomonaga, H., Tokue, T., Sakai, J., Suzuki, N., Murakami, K., Hiraga, T., Shigemoto, K., Tatebe, Y., Ohbuchi, E., Kayama, N., Edahiro, M., Kusano, T., & Nishi, N. (2005). A 600MIPS 120mW 70μA leakage triple-CPU mobile application processor chip. Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 48, 136-137+589.