TY - GEN
T1 - A 820 mb/s baseband processor LSI based on LDPC coded OFDM for UWB systems
AU - Ushiki, Shinsuke
AU - Nakamura, Koichi
AU - Shimizu, Kazunori
AU - Wang, Qi
AU - Abe, Yuta
AU - Goto, Satoshi
AU - Ikenaga, Takeshi
PY - 2008/12/1
Y1 - 2008/12/1
N2 - This paper presents a high-throughput and highlyreliable baseband processor LSI based on LDPC coding OFDM UWB. This LSI targets for wireless LAN systems inside a car which enable to translate a high-resolution video under noisy environment. A chip capable of operating at 147MHz was fabricated using UMC 0.13μm 1P8M CMOS technology. By adopting the OFDM modulation with 1024 sub-carriers, it achieves a throughput of 820Mb/s and 10-4 BER performance under 30dB CNR with 5/6 coding rate. Power dissipation is 189mW/391mW (TX/RX).
AB - This paper presents a high-throughput and highlyreliable baseband processor LSI based on LDPC coding OFDM UWB. This LSI targets for wireless LAN systems inside a car which enable to translate a high-resolution video under noisy environment. A chip capable of operating at 147MHz was fabricated using UMC 0.13μm 1P8M CMOS technology. By adopting the OFDM modulation with 1024 sub-carriers, it achieves a throughput of 820Mb/s and 10-4 BER performance under 30dB CNR with 5/6 coding rate. Power dissipation is 189mW/391mW (TX/RX).
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U2 - 10.1109/ASSCC.2008.4708786
DO - 10.1109/ASSCC.2008.4708786
M3 - Conference contribution
AN - SCOPUS:67650002047
SN - 9781424426058
T3 - Proceedings of 2008 IEEE Asian Solid-State Circuits Conference, A-SSCC 2008
SP - 297
EP - 300
BT - Proceedings of 2008 IEEE Asian Solid-State Circuits Conference, A-SSCC 2008
T2 - 2008 IEEE Asian Solid-State Circuits Conference, A-SSCC 2008
Y2 - 3 November 2008 through 5 November 2008
ER -