A CMOS embedded RF-MEMS tunable capacitor for multi-band/multi-mode smartphones

Y. Kurui, H. Yamazaki, Y. Shimooka, T. Saito, E. Ogawa, T. Ogawa, T. Ikehashi, Y. Sugizaki, H. Shibata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper reports on 1-chip RF-MEMS tunable capacitor that equips CMOS driver circuit in the underlying layer. A Wafer Level Chip Scale Package (WLCSP) optimized for RF-MEMS is employed to minimize the module size. The MEMS actuation voltage is generated by an Actuation Voltage Generator (AVG). The boost mechanism employed in the AVG enables instant high voltage generation and reduction of the dielectric charging. The measured noise at RF frequencies is less than -120dbm, thanks to a shield metal layer formed between MEMS and CMOS layers. To achieve high power handing and high creep immunity, we employ the previously reported techniques, the Quadruple Series Capacitor (QSC) [1] and the SiN springs [2]. The quality factor measured in the WLCSP is larger than 100 at 1GHz. The capacitance can be changed from 1.4pF to 5pF by a step of 0.45pF.

Original languageEnglish
Title of host publication2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Pages109-114
Number of pages6
DOIs
Publication statusPublished - 2012 Oct 4
Event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States
Duration: 2012 May 292012 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
CountryUnited States
CitySan Diego, CA
Period12/5/2912/6/1

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Kurui, Y., Yamazaki, H., Shimooka, Y., Saito, T., Ogawa, E., Ogawa, T., Ikehashi, T., Sugizaki, Y., & Shibata, H. (2012). A CMOS embedded RF-MEMS tunable capacitor for multi-band/multi-mode smartphones. In 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 (pp. 109-114). [6248814] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2012.6248814