A comprehensive analysis of the thermal cycling reliability of lead-free chip scale package assemblies with various reworkable board-level polymeric reinforcement strategies

Hongbin Shi*, Cuihua Tian, Daquan Yu, Toshitsugu Ueda

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)

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    Engineering & Materials Science

    Chemical Compounds