A data structure for triangular dissection of multi-resolution images

Taiyou Kikuchi, Shinji Koka, Koichi Anada, Youzou Miyadera, Takeo Yaku

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

In this work, the heterogeneous rectangular dissections that represent multi-resolution images of raster data are considered. Specifically, heterogeneous rectangular dissections are changed to triangular dissections in order to provide more effective feature extraction. We propose a method of generating triangular dissections that maintains 'octgrid' properties and have developed a list structure suitable for extracting image features (ridges, valleys, etc.) from terrain maps. We propose a detailed list structure called 'H12Code' and present examples of feature extraction using H12Code lists.

Original languageEnglish
Title of host publication2014 IEEE/ACIS 15th International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479956043
DOIs
Publication statusPublished - 2014
Event15th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking, and Parallel/Distributed Computing, SNPD 2014 - Las Vegas
Duration: 2014 Jun 302014 Jul 2

Other

Other15th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking, and Parallel/Distributed Computing, SNPD 2014
CityLas Vegas
Period14/6/3014/7/2

Fingerprint

Dissection
Image resolution
Data structures
Feature extraction

Keywords

  • data structures
  • feature extraction
  • multi-resolution images
  • triangulation

ASJC Scopus subject areas

  • Computer Science Applications
  • Computer Networks and Communications
  • Artificial Intelligence

Cite this

Kikuchi, T., Koka, S., Anada, K., Miyadera, Y., & Yaku, T. (2014). A data structure for triangular dissection of multi-resolution images. In 2014 IEEE/ACIS 15th International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2014 - Proceedings [6888732] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SNPD.2014.6888732

A data structure for triangular dissection of multi-resolution images. / Kikuchi, Taiyou; Koka, Shinji; Anada, Koichi; Miyadera, Youzou; Yaku, Takeo.

2014 IEEE/ACIS 15th International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014. 6888732.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kikuchi, T, Koka, S, Anada, K, Miyadera, Y & Yaku, T 2014, A data structure for triangular dissection of multi-resolution images. in 2014 IEEE/ACIS 15th International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2014 - Proceedings., 6888732, Institute of Electrical and Electronics Engineers Inc., 15th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking, and Parallel/Distributed Computing, SNPD 2014, Las Vegas, 14/6/30. https://doi.org/10.1109/SNPD.2014.6888732
Kikuchi T, Koka S, Anada K, Miyadera Y, Yaku T. A data structure for triangular dissection of multi-resolution images. In 2014 IEEE/ACIS 15th International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2014. 6888732 https://doi.org/10.1109/SNPD.2014.6888732
Kikuchi, Taiyou ; Koka, Shinji ; Anada, Koichi ; Miyadera, Youzou ; Yaku, Takeo. / A data structure for triangular dissection of multi-resolution images. 2014 IEEE/ACIS 15th International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014.
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