A improvement method of conceputual design ideas using Data Envelopment Analysis

Tomoyuki Miyashita, Daisuke Satoh

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    4 Citations (Scopus)

    Abstract

    The designers often are required to derive ideas of the products satisfying requirements of users and market. To accomplish to derive good design, it is important to have much information for previous designs and collaborate with the other designers. At an early stage of design process, several designers have to derive ideas considering its evaluation in cooperation. In this stage, some existing methods to support thinking processes among several persons are useful. However, it is difficult to give a direction for discussion because a reasonable evaluation of ideas is difficult and it is also difficult for the evaluation to be accepted by the other designers. In this study, we propose a method to support generating various and effective ideas in conceptual design process. The ideas are mathematically defined to have factors of evaluation and features and numerically treated in these factors space. Data Envelopment Analysis (DEA) is applied for ideas having many factors of evaluation to derive reasonably a scalar value for evaluation result. DEA gives us a segment of many ideas and from this segment we can discuss a new idea. To support deriving a new idea, we have identified nonlinear mathematical model between factors of evaluation and features and optimization method was applied for the identified model. The proposed method is applied for the experiment and we could confirm the effectiveness of the proposed method.

    Original languageEnglish
    Title of host publicationDS 58-6: Proceedings of ICED 09, the 17th International Conference on Engineering Design
    Pages13-22
    Number of pages10
    Volume6
    EditionPART 2
    Publication statusPublished - 2009
    Event17th International Conference on Engineering Design, ICED 09 - Palo Alto, CA
    Duration: 2009 Aug 242009 Aug 27

    Other

    Other17th International Conference on Engineering Design, ICED 09
    CityPalo Alto, CA
    Period09/8/2409/8/27

    Fingerprint

    Data envelopment analysis
    Data Envelopment Analysis
    Evaluation
    Conceptual design
    Design Process
    Mathematical models
    Conceptual Design
    Design
    Nonlinear Model
    Experiments
    Optimization Methods
    Person
    Scalar
    Mathematical Model
    Requirements
    Experiment

    Keywords

    • Conceptual design support
    • Data Envelopment Analysis
    • Visualization of ideas

    ASJC Scopus subject areas

    • Engineering (miscellaneous)
    • Modelling and Simulation

    Cite this

    Miyashita, T., & Satoh, D. (2009). A improvement method of conceputual design ideas using Data Envelopment Analysis. In DS 58-6: Proceedings of ICED 09, the 17th International Conference on Engineering Design (PART 2 ed., Vol. 6, pp. 13-22)

    A improvement method of conceputual design ideas using Data Envelopment Analysis. / Miyashita, Tomoyuki; Satoh, Daisuke.

    DS 58-6: Proceedings of ICED 09, the 17th International Conference on Engineering Design. Vol. 6 PART 2. ed. 2009. p. 13-22.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Miyashita, T & Satoh, D 2009, A improvement method of conceputual design ideas using Data Envelopment Analysis. in DS 58-6: Proceedings of ICED 09, the 17th International Conference on Engineering Design. PART 2 edn, vol. 6, pp. 13-22, 17th International Conference on Engineering Design, ICED 09, Palo Alto, CA, 09/8/24.
    Miyashita T, Satoh D. A improvement method of conceputual design ideas using Data Envelopment Analysis. In DS 58-6: Proceedings of ICED 09, the 17th International Conference on Engineering Design. PART 2 ed. Vol. 6. 2009. p. 13-22
    Miyashita, Tomoyuki ; Satoh, Daisuke. / A improvement method of conceputual design ideas using Data Envelopment Analysis. DS 58-6: Proceedings of ICED 09, the 17th International Conference on Engineering Design. Vol. 6 PART 2. ed. 2009. pp. 13-22
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