A Metal Bump Bonding Method Using Ag Nanoparticles as Intermediate Layer

Weixin Fu, Masatsugu Nimura, Takashi Kasahara, Hayata Mimatsu, Akiko Okada, Shuichi Shoji, Shugo Ishizuka, Jun Mizuno

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

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Physics & Astronomy

Chemical Compounds

Engineering & Materials Science