A method of "chemical flip-chip bonding" without loading and heating for ultra-fine chip-to-substrate interconnects

Tokihiko Yokoshima, Yasuhiro Yamaji, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science