A method to estimate kt2 of piezoelectric films from the change of lattice strain by XRD without removing substrate

Takumi Soutome, Takahiko Yanagitani

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electromechanical coupling coefficient kt2 is one of the important parameters to estimate performance of BAW filters. The resonance-antiresonance method according to IEEE standard is common method to determine kt2. However, this method requires a self-standing film structure (FBAR). In this study, we propose the kt2 estimation method for a film/substrate structure (HBAR). This method allows us to estimate kt2 for as grown wafers without removing substrates. The lattice strains of piezoelectric crystals are induced when electric field are applied. The strains can be measured by X-ray diffraction (XRD). Therefore, the kt2 of the film is expected to be indirectly determined by the use of piezoelectric equations. The values of kt2 determined by this method were compared with the resonance-antiresonance method and the conversion loss method.

Original languageEnglish
Title of host publication2019 IEEE International Ultrasonics Symposium, IUS 2019
PublisherIEEE Computer Society
Pages301-304
Number of pages4
ISBN (Electronic)9781728145969
DOIs
Publication statusPublished - 2019 Oct
Event2019 IEEE International Ultrasonics Symposium, IUS 2019 - Glasgow, United Kingdom
Duration: 2019 Oct 62019 Oct 9

Publication series

NameIEEE International Ultrasonics Symposium, IUS
Volume2019-October
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Conference

Conference2019 IEEE International Ultrasonics Symposium, IUS 2019
CountryUnited Kingdom
CityGlasgow
Period19/10/619/10/9

Keywords

  • FBAR
  • ScAlN
  • XRD
  • electro mechanical coupling coefficient
  • lattice
  • piezoelectric thin film

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

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    Soutome, T., & Yanagitani, T. (2019). A method to estimate kt2 of piezoelectric films from the change of lattice strain by XRD without removing substrate. In 2019 IEEE International Ultrasonics Symposium, IUS 2019 (pp. 301-304). [8925766] (IEEE International Ultrasonics Symposium, IUS; Vol. 2019-October). IEEE Computer Society. https://doi.org/10.1109/ULTSYM.2019.8925766