A novel expression of spatial correlation by a random curved surface model and its application to LSI design

Ohkawa Shin-ichi, Hiroo Masuda, Yasuaki Inoue

    Research output: Contribution to journalArticle

    1 Citation (Scopus)

    Abstract

    We have proposed a random curved surface model as a new mathematical concept which enables the expression of spatial corre-lation. The model gives us an appropriate methodology to deal with the systematic components of device variation in an LSI chip. The key idea of the model is the fitting of a polynomial to an array of Gaussian random numbers. The curved surface is expressed by a new extension from the Legendre polynomials to form two-dimensional formulas. The formulas were proven to be suitable to express the spatial correlation with reasonable computational complexity. In this paper, we show that this approach is useful in analyzing characteristics of device variation of actual chips by using experimental data.

    Original languageEnglish
    Pages (from-to)1062-1070
    Number of pages9
    JournalIEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
    VolumeE91-A
    Issue number4
    DOIs
    Publication statusPublished - 2008

    Fingerprint

    Random Surfaces
    Curved Surface
    Spatial Correlation
    Chip
    Polynomials
    Legendre polynomial
    Random number
    Computational complexity
    Computational Complexity
    Express
    Experimental Data
    Model
    Polynomial
    Methodology
    Design

    Keywords

    • Device variation
    • Gaussian
    • LSI design
    • Random curved surface
    • Systematic part

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Computer Graphics and Computer-Aided Design
    • Applied Mathematics
    • Signal Processing

    Cite this

    A novel expression of spatial correlation by a random curved surface model and its application to LSI design. / Shin-ichi, Ohkawa; Masuda, Hiroo; Inoue, Yasuaki.

    In: IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, Vol. E91-A, No. 4, 2008, p. 1062-1070.

    Research output: Contribution to journalArticle

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