A novel in-plane digitalization of multiphase microfluids

Jeung Sang Go, M. Kanai, Shuichi Shoji

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    The in-plane digitalization of the multiphase microfluid is presented in low Reynolds number flow regime. It is achieved by manipulation of the pitch of the alternate microfluid flow and the delay distance resulting form hydrodynamics in special microchannels. The theoretical analysis derives delay distance. For the experimental evaluation, a characteristic in-plane microchannel is fabricated. Specifically, digital sorting is attempted by introducing two immiscible fluids. Also, we examine digital lamination of two miscible fluids. Finally, the digitalization is characterized qualitatively and qualitatively by using micro-PIV measurement. The short diffusion path and large contact surface obtained from digital lamination is applicable to chemical and biochemical reaction.

    Original languageEnglish
    Title of host publicationTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages1808-1811
    Number of pages4
    Volume2
    ISBN (Print)0780377311, 9780780377318
    DOIs
    Publication statusPublished - 2003
    Event12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
    Duration: 2003 Jun 82003 Jun 12

    Other

    Other12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
    CountryUnited States
    CityBoston
    Period03/6/803/6/12

    Fingerprint

    Microchannels
    Fluids
    Sorting
    Reynolds number
    Hydrodynamics

    Keywords

    • Bifurcation
    • Chemicals
    • Delay
    • Fluid flow
    • Hydrodynamics
    • Lamination
    • Microchannel
    • Microfluidics
    • Micromechanical devices
    • Sorting

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Cite this

    Go, J. S., Kanai, M., & Shoji, S. (2003). A novel in-plane digitalization of multiphase microfluids. In TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers (Vol. 2, pp. 1808-1811). [1217138] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SENSOR.2003.1217138

    A novel in-plane digitalization of multiphase microfluids. / Go, Jeung Sang; Kanai, M.; Shoji, Shuichi.

    TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. Vol. 2 Institute of Electrical and Electronics Engineers Inc., 2003. p. 1808-1811 1217138.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Go, JS, Kanai, M & Shoji, S 2003, A novel in-plane digitalization of multiphase microfluids. in TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. vol. 2, 1217138, Institute of Electrical and Electronics Engineers Inc., pp. 1808-1811, 12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers, Boston, United States, 03/6/8. https://doi.org/10.1109/SENSOR.2003.1217138
    Go JS, Kanai M, Shoji S. A novel in-plane digitalization of multiphase microfluids. In TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. Vol. 2. Institute of Electrical and Electronics Engineers Inc. 2003. p. 1808-1811. 1217138 https://doi.org/10.1109/SENSOR.2003.1217138
    Go, Jeung Sang ; Kanai, M. ; Shoji, Shuichi. / A novel in-plane digitalization of multiphase microfluids. TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. Vol. 2 Institute of Electrical and Electronics Engineers Inc., 2003. pp. 1808-1811
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