A novel lift off process and its application for capacitive tilt sensor

Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    6 Citations (Scopus)

    Abstract

    This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

    Original languageEnglish
    Title of host publicationProceedings of IEEE Sensors
    Pages1422-1425
    Number of pages4
    DOIs
    Publication statusPublished - 2006
    Event2006 5th IEEE Conference on Sensors - Daegu
    Duration: 2006 Oct 222006 Oct 25

    Other

    Other2006 5th IEEE Conference on Sensors
    CityDaegu
    Period06/10/2206/10/25

    Fingerprint

    Capacitive sensors
    Substrates
    Quartz

    ASJC Scopus subject areas

    • Engineering (miscellaneous)
    • Electrical and Electronic Engineering

    Cite this

    Liang, J., Kohsaka, F., Matsuo, T., & Ueda, T. (2006). A novel lift off process and its application for capacitive tilt sensor. In Proceedings of IEEE Sensors (pp. 1422-1425). [4178894] https://doi.org/10.1109/ICSENS.2007.355899

    A novel lift off process and its application for capacitive tilt sensor. / Liang, Jinxing; Kohsaka, Fusao; Matsuo, Takahiro; Ueda, Toshitsugu.

    Proceedings of IEEE Sensors. 2006. p. 1422-1425 4178894.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Liang, J, Kohsaka, F, Matsuo, T & Ueda, T 2006, A novel lift off process and its application for capacitive tilt sensor. in Proceedings of IEEE Sensors., 4178894, pp. 1422-1425, 2006 5th IEEE Conference on Sensors, Daegu, 06/10/22. https://doi.org/10.1109/ICSENS.2007.355899
    Liang J, Kohsaka F, Matsuo T, Ueda T. A novel lift off process and its application for capacitive tilt sensor. In Proceedings of IEEE Sensors. 2006. p. 1422-1425. 4178894 https://doi.org/10.1109/ICSENS.2007.355899
    Liang, Jinxing ; Kohsaka, Fusao ; Matsuo, Takahiro ; Ueda, Toshitsugu. / A novel lift off process and its application for capacitive tilt sensor. Proceedings of IEEE Sensors. 2006. pp. 1422-1425
    @inproceedings{82cbac18452c493893e96ce21ddb87a1,
    title = "A novel lift off process and its application for capacitive tilt sensor",
    abstract = "This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.",
    author = "Jinxing Liang and Fusao Kohsaka and Takahiro Matsuo and Toshitsugu Ueda",
    year = "2006",
    doi = "10.1109/ICSENS.2007.355899",
    language = "English",
    isbn = "1424403766",
    pages = "1422--1425",
    booktitle = "Proceedings of IEEE Sensors",

    }

    TY - GEN

    T1 - A novel lift off process and its application for capacitive tilt sensor

    AU - Liang, Jinxing

    AU - Kohsaka, Fusao

    AU - Matsuo, Takahiro

    AU - Ueda, Toshitsugu

    PY - 2006

    Y1 - 2006

    N2 - This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

    AB - This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

    UR - http://www.scopus.com/inward/record.url?scp=50149119272&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=50149119272&partnerID=8YFLogxK

    U2 - 10.1109/ICSENS.2007.355899

    DO - 10.1109/ICSENS.2007.355899

    M3 - Conference contribution

    AN - SCOPUS:50149119272

    SN - 1424403766

    SN - 9781424403769

    SP - 1422

    EP - 1425

    BT - Proceedings of IEEE Sensors

    ER -