A self assembly monolayer activated electroless deposition process for interconnect and contact applications

Y. Shacham-Diamand, M. Yoshino, A. Duhin, Y. Sverdlov, Tetsuya Osaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The use of self assembly monolayer has been demonstrated for direct plating on interlevel dielectric for interconnects applications. In this work we show an additional feature of that technique for direct deposition on contact application. We also present an integrated process where the self assembly activation is used for both the deposition of the barrier layer which can be used for both the contact material and the source for the silicidation process. Later all wet electroless process can be used for the contact buildup and the capping layer deposition. In this work we review the depositions of electroless Nickel alloy on various inter level dielectrics and on Si. We also discuss the integration process including deposition on exiting silicide or possible self silicidation for the formation of self aligned NiSi. We describe the process outlines and present material and electrical properties.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference (AMC)
Pages657-662
Number of pages6
Volume2006
Publication statusPublished - 2006
Event23rd Annual Advanced Metallization Conference, AMC 2006 - San Diego, CA
Duration: 2006 Oct 172006 Oct 19

Other

Other23rd Annual Advanced Metallization Conference, AMC 2006
CitySan Diego, CA
Period06/10/1706/10/19

Fingerprint

Electroless plating
Self assembly
Monolayers
Nickel alloys
Plating
Materials properties
Electric properties
Chemical activation

ASJC Scopus subject areas

  • Chemical Engineering(all)

Cite this

Shacham-Diamand, Y., Yoshino, M., Duhin, A., Sverdlov, Y., & Osaka, T. (2006). A self assembly monolayer activated electroless deposition process for interconnect and contact applications. In Advanced Metallization Conference (AMC) (Vol. 2006, pp. 657-662)

A self assembly monolayer activated electroless deposition process for interconnect and contact applications. / Shacham-Diamand, Y.; Yoshino, M.; Duhin, A.; Sverdlov, Y.; Osaka, Tetsuya.

Advanced Metallization Conference (AMC). Vol. 2006 2006. p. 657-662.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Shacham-Diamand, Y, Yoshino, M, Duhin, A, Sverdlov, Y & Osaka, T 2006, A self assembly monolayer activated electroless deposition process for interconnect and contact applications. in Advanced Metallization Conference (AMC). vol. 2006, pp. 657-662, 23rd Annual Advanced Metallization Conference, AMC 2006, San Diego, CA, 06/10/17.
Shacham-Diamand Y, Yoshino M, Duhin A, Sverdlov Y, Osaka T. A self assembly monolayer activated electroless deposition process for interconnect and contact applications. In Advanced Metallization Conference (AMC). Vol. 2006. 2006. p. 657-662
Shacham-Diamand, Y. ; Yoshino, M. ; Duhin, A. ; Sverdlov, Y. ; Osaka, Tetsuya. / A self assembly monolayer activated electroless deposition process for interconnect and contact applications. Advanced Metallization Conference (AMC). Vol. 2006 2006. pp. 657-662
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