A self assembly monolayer activated electroless deposition process for interconnect and contact applications

Y. Shacham-Diamand, M. Yoshino, A. Duhin, Y. Sverdlov, T. Osaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The use of self assembly monolayer has been demonstrated for direct plating on interlevel dielectric for interconnects applications. In this work we show an additional feature of that technique for direct deposition on contact application. We also present an integrated process where the self assembly activation is used for both the deposition of the barrier layer which can be used for both the contact material and the source for the silicidation process. Later all wet electroless process can be used for the contact buildup and the capping layer deposition. In this work we review the depositions of electroless Nickel alloy on various inter level dielectrics and on Si. We also discuss the integration process including deposition on exiting silicide or possible self silicidation for the formation of self aligned NiSi. We describe the process outlines and present material and electrical properties.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference 2006, AMC 2006
Pages657-662
Number of pages6
Publication statusPublished - 2006 Dec 1
Event23rd Annual Advanced Metallization Conference, AMC 2006 - San Diego, CA, United States
Duration: 2006 Oct 172006 Oct 19

Publication series

NameAdvanced Metallization Conference (AMC)
Volume2006
ISSN (Print)1540-1766

Conference

Conference23rd Annual Advanced Metallization Conference, AMC 2006
CountryUnited States
CitySan Diego, CA
Period06/10/1706/10/19

ASJC Scopus subject areas

  • Chemical Engineering(all)

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  • Cite this

    Shacham-Diamand, Y., Yoshino, M., Duhin, A., Sverdlov, Y., & Osaka, T. (2006). A self assembly monolayer activated electroless deposition process for interconnect and contact applications. In Advanced Metallization Conference 2006, AMC 2006 (pp. 657-662). (Advanced Metallization Conference (AMC); Vol. 2006).