A sorting-based micro-bump assignment for 3D ICs

Ran Zhang, Tieyuan Pan, Takahiro Watanabe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Recently RDLs (Re-Distribution Layers) and micro-bumps are widely adopted in 3D IC designs. In this research, a sorting-based micro-bump assignment method is proposed. The approach initially assigns the I/O pads to micro-bumps by sorting the Manhattan distance between them. Then single layer routing in two RDLs are carried out respectively. The experimental results show that the proposed method is able to obtain the routes with shorter total wire length in reasonable CPU times.

Original languageEnglish
Title of host publicationISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE)
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages139-140
Number of pages2
ISBN (Print)9781467393089
DOIs
Publication statusPublished - 2016 Feb 8
Event12th International SoC Design Conference, ISOCC 2015 - Gyeongju, Korea, Republic of
Duration: 2015 Nov 22015 Nov 5

Other

Other12th International SoC Design Conference, ISOCC 2015
CountryKorea, Republic of
CityGyeongju
Period15/11/215/11/5

Fingerprint

Sorting
Program processors
Wire
Integrated circuit design

Keywords

  • 3D IC
  • micro-bump assignment
  • RDL routing

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Zhang, R., Pan, T., & Watanabe, T. (2016). A sorting-based micro-bump assignment for 3D ICs. In ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE) (pp. 139-140). [7401697] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2015.7401697

A sorting-based micro-bump assignment for 3D ICs. / Zhang, Ran; Pan, Tieyuan; Watanabe, Takahiro.

ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE). Institute of Electrical and Electronics Engineers Inc., 2016. p. 139-140 7401697.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zhang, R, Pan, T & Watanabe, T 2016, A sorting-based micro-bump assignment for 3D ICs. in ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE)., 7401697, Institute of Electrical and Electronics Engineers Inc., pp. 139-140, 12th International SoC Design Conference, ISOCC 2015, Gyeongju, Korea, Republic of, 15/11/2. https://doi.org/10.1109/ISOCC.2015.7401697
Zhang R, Pan T, Watanabe T. A sorting-based micro-bump assignment for 3D ICs. In ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE). Institute of Electrical and Electronics Engineers Inc. 2016. p. 139-140. 7401697 https://doi.org/10.1109/ISOCC.2015.7401697
Zhang, Ran ; Pan, Tieyuan ; Watanabe, Takahiro. / A sorting-based micro-bump assignment for 3D ICs. ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE). Institute of Electrical and Electronics Engineers Inc., 2016. pp. 139-140
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