Abstract
Recently RDLs (Re-Distribution Layers) and micro-bumps are widely adopted in 3D IC designs. In this research, a sorting-based micro-bump assignment method is proposed. The approach initially assigns the I/O pads to micro-bumps by sorting the Manhattan distance between them. Then single layer routing in two RDLs are carried out respectively. The experimental results show that the proposed method is able to obtain the routes with shorter total wire length in reasonable CPU times.
| Original language | English |
|---|---|
| Title of host publication | ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE) |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 139-140 |
| Number of pages | 2 |
| ISBN (Print) | 9781467393089 |
| DOIs | |
| Publication status | Published - 2016 Feb 8 |
| Event | 12th International SoC Design Conference, ISOCC 2015 - Gyeongju, Korea, Republic of Duration: 2015 Nov 2 → 2015 Nov 5 |
Other
| Other | 12th International SoC Design Conference, ISOCC 2015 |
|---|---|
| Country/Territory | Korea, Republic of |
| City | Gyeongju |
| Period | 15/11/2 → 15/11/5 |
Keywords
- 3D IC
- micro-bump assignment
- RDL routing
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials