A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A direct bonding of polyoxymethelene (POM) was feasible at 100 °C by using self-assembled monolayers (SAM) as surface modification method. (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS) were applied in our work. Surface modification carried out with different VUV/O3 irradiation conditions showed different bonding strength. In addition, the bonding condition with highest strength had an average strength of 0.37 MPa. This technology was expected to be used in packaging for micro/nano electromechanical systems (MEMS/NMES), such as bio-/medical devices.

Original languageEnglish
Title of host publicationProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages69
Number of pages1
ISBN (Electronic)9784904743034
DOIs
Publication statusPublished - 2017 Jun 13
Event5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
Duration: 2017 May 162017 May 18

Other

Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
CountryJapan
CityTokyo
Period17/5/1617/5/18

Fingerprint

Self assembled monolayers
Irradiation
Surface treatment
Temperature
MEMS
Packaging

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

Cite this

Fu, W., Ma, B., Kuwae, H., Shoji, S., & Mizuno, J. (2017). A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 (pp. 69). [7947465] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947465

A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation. / Fu, Weixin; Ma, Bo; Kuwae, Hiroyuki; Shoji, Shuichi; Mizuno, Jun.

Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 69 7947465.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fu, W, Ma, B, Kuwae, H, Shoji, S & Mizuno, J 2017, A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation. in Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017., 7947465, Institute of Electrical and Electronics Engineers Inc., pp. 69, 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Tokyo, Japan, 17/5/16. https://doi.org/10.23919/LTB-3D.2017.7947465
Fu W, Ma B, Kuwae H, Shoji S, Mizuno J. A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 69. 7947465 https://doi.org/10.23919/LTB-3D.2017.7947465
Fu, Weixin ; Ma, Bo ; Kuwae, Hiroyuki ; Shoji, Shuichi ; Mizuno, Jun. / A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation. Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 69
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