A study on the low temperature sintering-bonding through in-situ formation of Ag nanoparticles using Ag2O microparticles

Fengwen Mu, Guisheng Zou, Jianfeng Yan, Hailin Bai, Aiping Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Based on the rapid sintering characteristic of nanoparticles at a relatively low temperature, a novel bonding process using Ag metallo-organic nanoparticle paste has been proposed. This paste is considered as an alternative for lead-rich high temperature solder. However, further decrease of bonding temperature and pressure is required for industrial application. Additionally, the cost of Ag nanoparticle preparation is relatively high. In this paper, Ag2O powders were mixed with triethylene glycol (TEG) as a reducing agent to form a paste, which was used to bond the Ag-coated Cu bulks. The TEG shew its reducibility to Ag2O at temperature as low as 110 °C. It could be inferred that when the paste was heated above 110°C, in-situ formation of Ag nanoparticles would occur in the sintering process. With the increasing of sintering time and temperature, more and more Ag nanoparticles would be formed and sintered. The effects of sintering-bonding temperature and external bonding pressure on joint strength and microstructures were studied. The shear strength increased with sintering temperature and reached up to about 22MPa at sintering temperature of 250°C under pressure of 2MPa. In addition, the strength first increased with pressure and then began to decrease under 5MPa. Moreover, the microstructures of the joints were observed and analyzed by FE-SEM.

Original languageEnglish
Title of host publicationICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
Pages293-301
Number of pages9
DOIs
Publication statusPublished - 2011 Nov 22
Externally publishedYes
Event2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai, China
Duration: 2011 Aug 82011 Aug 11

Publication series

NameICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Conference

Conference2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
CountryChina
CityShanghai
Period11/8/811/8/11

Fingerprint

Sintering
Nanoparticles
Temperature
Glycols
Microstructure
Adhesive pastes
Reducing agents
Shear strength
Soldering alloys
Industrial applications
Lead
Powders
Scanning electron microscopy
Costs

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Mu, F., Zou, G., Yan, J., Bai, H., & Wu, A. (2011). A study on the low temperature sintering-bonding through in-situ formation of Ag nanoparticles using Ag2O microparticles. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (pp. 293-301). [6066839] (ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging). https://doi.org/10.1109/ICEPT.2011.6066839

A study on the low temperature sintering-bonding through in-situ formation of Ag nanoparticles using Ag2O microparticles. / Mu, Fengwen; Zou, Guisheng; Yan, Jianfeng; Bai, Hailin; Wu, Aiping.

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 293-301 6066839 (ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mu, F, Zou, G, Yan, J, Bai, H & Wu, A 2011, A study on the low temperature sintering-bonding through in-situ formation of Ag nanoparticles using Ag2O microparticles. in ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging., 6066839, ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, pp. 293-301, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, China, 11/8/8. https://doi.org/10.1109/ICEPT.2011.6066839
Mu F, Zou G, Yan J, Bai H, Wu A. A study on the low temperature sintering-bonding through in-situ formation of Ag nanoparticles using Ag2O microparticles. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 293-301. 6066839. (ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging). https://doi.org/10.1109/ICEPT.2011.6066839
Mu, Fengwen ; Zou, Guisheng ; Yan, Jianfeng ; Bai, Hailin ; Wu, Aiping. / A study on the low temperature sintering-bonding through in-situ formation of Ag nanoparticles using Ag2O microparticles. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. pp. 293-301 (ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging).
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