A study on the sense of burden and body ownership on virtual slope

Ryo Shimamura, Seita Kayukawa, Takayuki Nakatsuka, Shoki Miyakawa, Shigeo Morishima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper provides insight into the burden when people are walking up and down slopes in a virtual environment (VE) while actually walking on a flat floor in the real environment (RE). In RE, we feel a physical load during walking uphill or downhill. To reproduce such physical load in the VE, we provided visual stimuli to users by changing their step length. In order to investigate how the stimuli affect a sense of burden and body ownership, we performed a user study where participants walked on slopes in the VE. We found that changing the step length has a significant impact on a burden on the user and less correlation between body ownership and step length.

Original languageEnglish
Title of host publication26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1154-1155
Number of pages2
ISBN (Electronic)9781728113777
DOIs
Publication statusPublished - 2019 Mar 1
Event26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019 - Osaka, Japan
Duration: 2019 Mar 232019 Mar 27

Publication series

Name26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019 - Proceedings

Conference

Conference26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019
CountryJapan
CityOsaka
Period19/3/2319/3/27

Keywords

  • Centered computing
  • Human
  • Virtual reality

ASJC Scopus subject areas

  • Human-Computer Interaction
  • Media Technology

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  • Cite this

    Shimamura, R., Kayukawa, S., Nakatsuka, T., Miyakawa, S., & Morishima, S. (2019). A study on the sense of burden and body ownership on virtual slope. In 26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019 - Proceedings (pp. 1154-1155). [8797960] (26th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2019 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VR.2019.8797960