A theoretical study of thermal stress for engineering applications

Mrinal Bhowmik*, Payai Banerjee, Manoj Kumar Bhowmik

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapter

Fingerprint

Dive into the research topics of 'A theoretical study of thermal stress for engineering applications'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds