A via hole based superconducting wiring method for enhanced X-ray image sensors

H. Kudo; S. Ohtsuka; T. Arakawa; T. Izumi; S. Shoji; H. Sato; H. Kobayashi; K. Mori; T. Homma; T. Osaka; K. Mitsuda; N. Y. Yamasaki; R. Fujimoto; N. Iyomoto; T. Oshima; K. Futamoto; Y. Takei; T. Ichitsubo; T. Fujimori; Y. Ishisaki; U. Morita; T. Koga; K. Sato; T. Ohashi; Y. Kuroda; M. Onishi; K. Otake

doi:10.1109/IMNC.2003.1268635

A via hole based superconducting wiring method for enhanced X-ray image sensors

H. Kudo, S. Ohtsuka, T. Arakawa, T. Izumi, S. Shoji, H. Sato, H. Kobayashi, K. Mori, T. Homma, T. Osaka, K. Mitsuda, N. Y. Yamasaki, R. Fujimoto, N. Iyomoto, T. Oshima, K. Futamoto, Y. Takei, T. Ichitsubo, T. Fujimori, Y. IshisakiU. Morita, T. Koga, K. Sato, T. Ohashi, Y. Kuroda, M. Onishi, K. Otake

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In this paper we developed through-wafer interconnections using only a simple fabrication process. The interconnection was successfully transformed into the superconducting state. A current density of 13 cm/sup 2//mA was obtained in the superconducting state. We realize high energy-resolution X-ray imaging using the superconducting through-wafer interconnections.

Original language	English
Title of host publication	Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	182-183
Number of pages	2
ISBN (Electronic)	4891140402, 9784891140403
DOIs	https://doi.org/10.1109/IMNC.2003.1268635
Publication status	Published - 2003
Event	International Microprocesses and Nanotechnology Conference, MNC 2003 - Tokyo, Japan Duration: 2003 Oct 29 → 2003 Oct 31

Publication series

Name	Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003

Other

Other	International Microprocesses and Nanotechnology Conference, MNC 2003
Country/Territory	Japan
City	Tokyo
Period	03/10/29 → 03/10/31

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/IMNC.2003.1268635

Cite this

Kudo, H., Ohtsuka, S., Arakawa, T., Izumi, T., Shoji, S., Sato, H., Kobayashi, H., Mori, K., Homma, T., Osaka, T., Mitsuda, K., Yamasaki, N. Y., Fujimoto, R., Iyomoto, N., Oshima, T., Futamoto, K., Takei, Y., Ichitsubo, T., Fujimori, T., ... Otake, K. (2003). A via hole based superconducting wiring method for enhanced X-ray image sensors. In Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003 (pp. 182-183). [1268635] (Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMNC.2003.1268635

A via hole based superconducting wiring method for enhanced X-ray image sensors. / Kudo, H.; Ohtsuka, S.; Arakawa, T. et al.

Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003. Institute of Electrical and Electronics Engineers Inc., 2003. p. 182-183 1268635 (Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kudo, H, Ohtsuka, S, Arakawa, T, Izumi, T, Shoji, S, Sato, H, Kobayashi, H, Mori, K, Homma, T , Osaka, T, Mitsuda, K, Yamasaki, NY, Fujimoto, R, Iyomoto, N, Oshima, T, Futamoto, K, Takei, Y, Ichitsubo, T, Fujimori, T, Ishisaki, Y, Morita, U, Koga, T, Sato, K, Ohashi, T, Kuroda, Y, Onishi, M & Otake, K 2003, A via hole based superconducting wiring method for enhanced X-ray image sensors. in Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003., 1268635, Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003, Institute of Electrical and Electronics Engineers Inc., pp. 182-183, International Microprocesses and Nanotechnology Conference, MNC 2003, Tokyo, Japan, 03/10/29. https://doi.org/10.1109/IMNC.2003.1268635

Kudo H, Ohtsuka S, Arakawa T, Izumi T, Shoji S, Sato H et al. A via hole based superconducting wiring method for enhanced X-ray image sensors. In Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003. Institute of Electrical and Electronics Engineers Inc. 2003. p. 182-183. 1268635. (Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003). doi: 10.1109/IMNC.2003.1268635

Kudo, H. ; Ohtsuka, S. ; Arakawa, T. et al. / A via hole based superconducting wiring method for enhanced X-ray image sensors. Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003. Institute of Electrical and Electronics Engineers Inc., 2003. pp. 182-183 (Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003).

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title = "A via hole based superconducting wiring method for enhanced X-ray image sensors",

abstract = "In this paper we developed through-wafer interconnections using only a simple fabrication process. The interconnection was successfully transformed into the superconducting state. A current density of 13 cm/sup 2//mA was obtained in the superconducting state. We realize high energy-resolution X-ray imaging using the superconducting through-wafer interconnections.",

author = "H. Kudo and S. Ohtsuka and T. Arakawa and T. Izumi and S. Shoji and H. Sato and H. Kobayashi and K. Mori and T. Homma and T. Osaka and K. Mitsuda and Yamasaki, {N. Y.} and R. Fujimoto and N. Iyomoto and T. Oshima and K. Futamoto and Y. Takei and T. Ichitsubo and T. Fujimori and Y. Ishisaki and U. Morita and T. Koga and K. Sato and T. Ohashi and Y. Kuroda and M. Onishi and K. Otake",

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AU - Kudo, H.

AU - Ohtsuka, S.

AU - Arakawa, T.

AU - Izumi, T.

AU - Shoji, S.

AU - Sato, H.

AU - Kobayashi, H.

AU - Mori, K.

AU - Homma, T.

AU - Osaka, T.

AU - Mitsuda, K.

AU - Yamasaki, N. Y.

AU - Fujimoto, R.

AU - Iyomoto, N.

AU - Oshima, T.

AU - Futamoto, K.

AU - Takei, Y.

AU - Ichitsubo, T.

AU - Fujimori, T.

AU - Ishisaki, Y.

AU - Morita, U.

AU - Koga, T.

AU - Sato, K.

AU - Ohashi, T.

AU - Kuroda, Y.

AU - Onishi, M.

AU - Otake, K.

PY - 2003

Y1 - 2003

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AB - In this paper we developed through-wafer interconnections using only a simple fabrication process. The interconnection was successfully transformed into the superconducting state. A current density of 13 cm/sup 2//mA was obtained in the superconducting state. We realize high energy-resolution X-ray imaging using the superconducting through-wafer interconnections.

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BT - Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - International Microprocesses and Nanotechnology Conference, MNC 2003

Y2 - 29 October 2003 through 31 October 2003

ER -

A via hole based superconducting wiring method for enhanced X-ray image sensors

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