Abstract
In this paper we developed through-wafer interconnections using only a simple fabrication process. The interconnection was successfully transformed into the superconducting state. A current density of 13 cm/sup 2//mA was obtained in the superconducting state. We realize high energy-resolution X-ray imaging using the superconducting through-wafer interconnections.
Original language | English |
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Title of host publication | Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 182-183 |
Number of pages | 2 |
ISBN (Print) | 4891140402, 9784891140403 |
DOIs | |
Publication status | Published - 2003 |
Event | International Microprocesses and Nanotechnology Conference, MNC 2003 - Tokyo, Japan Duration: 2003 Oct 29 → 2003 Oct 31 |
Other
Other | International Microprocesses and Nanotechnology Conference, MNC 2003 |
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Country | Japan |
City | Tokyo |
Period | 03/10/29 → 03/10/31 |
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering