A wet process for forming an adhesive copper layer on polyimide film

Tetsuya Osaka*, Satoshi Wakatsuki, Toyoto Masuda, Masahiro Yoshino, Noriyuki Yamachika, Junji Sasano, Itsuaki Matsuda, Yutaka Okinaka

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds