The progress of optical communication systems has been supported greatly by the packaging technology of optical components and devices. The mainstream packaging technique has been to skillfully miniaturize the optical system on an optical bench into a package, and this has been made possible by microoptic elements and fine adjustment of the optical axis and positions. With the advent of the 90s, radical technological innovations are required for optical packaging. In view of this, significant improvements and proposed novel solutions that have appeared in recent years are reviewed.
|Number of pages||13|
|Journal||Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi)|
|Publication status||Published - 1995 Jan|
ASJC Scopus subject areas
- Electrical and Electronic Engineering